XC17S30XLVO8C
- Mfr.Part #
- XC17S30XLVO8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC 3V PROM SER 300K 8-SOIC
- Stock
- 23,952
- In Stock :
- 23,952
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Base Part Number :
- XC17S30XL
- Packaging :
- Tube
- Terminal Pitch :
- 1.27mm
- Pin Count :
- 8
- Voltage - Supply :
- 3V~3.6V
- Standby Current-Max :
- 0.00005A
- Memory Width :
- 1
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- JESD-609 Code :
- e0
- Qualification Status :
- Not Qualified
- Supply Current-Max :
- 0.005mA
- Length :
- 4.9mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage-Min (Vsup) :
- 3V
- Supply Voltage :
- 3.3V
- Operating Mode :
- SYNCHRONOUS
- RoHS Status :
- Non-RoHS Compliant
- Power Supplies :
- 3.3V
- Terminal Form :
- Gull wing
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- ECCN Code :
- EAR99
- Height Seated (Max) :
- 1.2mm
- Reach Compliance Code :
- not_compliant
- I/O Type :
- COMMON
- Number of Terminations :
- 8
- Pbfree Code :
- No
- Supply Voltage-Max (Vsup) :
- 3.6V
- Output Characteristics :
- 3-STATE
- Memory IC Type :
- MEMORY CIRCUIT
- Published :
- 1999
- Number of Pins :
- 8
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~70°C
- Terminal Position :
- Dual
- Programmable Type :
- OTP
- Peak Reflow Temperature (Cel) :
- 225
- Lead Free :
- Contains Lead
- Surface Mount :
- yes
- Memory Size :
- 300kb
- Width :
- 3.9mm
- Clock Frequency :
- 10MHz
- Datasheets
- XC17S30XLVO8C

[Configuration Proms for FPGAs] Overview
Introducing the XC17S30XLVO8C from AMD Xilinx, a cutting-edge integrated circuit designed to optimize the performance of Field Programmable Gate Arrays (FPGAs). This IC boasts a 3V PROM SER with a capacity of 300K, encapsulated in an 8SOIC package. Engineered with precision and reliability in mind, this solution stands as a testament to AMD Xilinx's commitment to excellence in electronic components.
XC17S30XLVO8C Features
- Highly compatible with Field Programmable Gate Arrays (FPGAs)
- 3V PROM SER with a generous capacity of 300K
- Compact and durable 8SOIC package
- Engineered for reliability and precision
XC17S30XLVO8C Applications
- Configuration storage for FPGA-based industrial automation systems: The XC17S30XLVO8C serves as a vital component in industrial automation setups, ensuring seamless configuration storage and quick retrieval for optimal system performance.
- Firmware storage in telecommunications equipment: Leveraging its high capacity and reliability, this IC finds its place in telecommunications devices, storing critical firmware data to facilitate smooth operation and robust connectivity.
- Embedded system configuration in aerospace applications: In aerospace environments where reliability is paramount, the XC17S30XLVO8C shines by providing secure and efficient storage of configuration data for embedded systems, ensuring mission-critical operations.
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