XC17S30XLVO8C

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Mfr.Part #
XC17S30XLVO8C
Manufacturer
AMD Xilinx
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC 3V PROM SER 300K 8-SOIC
Stock
23,952
In Stock :
23,952

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Supply Voltage-Min (Vsup) :
3V
ECCN Code :
EAR99
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Published :
1999
Width :
3.9mm
Output Characteristics :
3-STATE
Lead Free :
Contains Lead
Memory Width :
1
Terminal Position :
Dual
Operating Mode :
SYNCHRONOUS
Programmable Type :
OTP
RoHS Status :
Non-RoHS Compliant
Supply Current-Max :
0.005mA
I/O Type :
COMMON
Pin Count :
8
Number of Functions :
1
Surface Mount :
yes
Pbfree Code :
No
Base Part Number :
XC17S30XL
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Standby Current-Max :
0.00005A
Reach Compliance Code :
not_compliant
JESD-609 Code :
e0
Power Supplies :
3.3V
Height Seated (Max) :
1.2mm
Memory Size :
300kb
Mounting Type :
Surface Mount
Terminal Pitch :
1.27mm
Number of Terminations :
8
Packaging :
Tube
Supply Voltage :
3.3V
Qualification Status :
Not Qualified
Terminal Form :
Gull wing
Number of Pins :
8
Operating Temperature :
0°C~70°C
Length :
4.9mm
Time@Peak Reflow Temperature-Max (s) :
30
Memory IC Type :
MEMORY CIRCUIT
Voltage - Supply :
3V~3.6V
Supply Voltage-Max (Vsup) :
3.6V
Clock Frequency :
10MHz
Peak Reflow Temperature (Cel) :
225
Datasheets
XC17S30XLVO8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30XLVO8C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17S30XL, Package / Case:8-SOIC (0.154, 3.90mm Width), Mounting Type:Surface Mount, Number of Terminations:8, Number of Pins:8, Operating Temperature:0°C~70°C, XC17S30XLVO8C pinout, XC17S30XLVO8C datasheet PDF, XC17S30XLVO8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30XLVO8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30XLVO8C


[Configuration Proms for FPGAs] Overview

Introducing the XC17S30XLVO8C from AMD Xilinx, a cutting-edge integrated circuit designed to optimize the performance of Field Programmable Gate Arrays (FPGAs). This IC boasts a 3V PROM SER with a capacity of 300K, encapsulated in an 8SOIC package. Engineered with precision and reliability in mind, this solution stands as a testament to AMD Xilinx's commitment to excellence in electronic components.

XC17S30XLVO8C Features

  • Highly compatible with Field Programmable Gate Arrays (FPGAs)
  • 3V PROM SER with a generous capacity of 300K
  • Compact and durable 8SOIC package
  • Engineered for reliability and precision

XC17S30XLVO8C Applications

  • Configuration storage for FPGA-based industrial automation systems: The XC17S30XLVO8C serves as a vital component in industrial automation setups, ensuring seamless configuration storage and quick retrieval for optimal system performance.
  • Firmware storage in telecommunications equipment: Leveraging its high capacity and reliability, this IC finds its place in telecommunications devices, storing critical firmware data to facilitate smooth operation and robust connectivity.
  • Embedded system configuration in aerospace applications: In aerospace environments where reliability is paramount, the XC17S30XLVO8C shines by providing secure and efficient storage of configuration data for embedded systems, ensuring mission-critical operations.
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