XC17S30XLPDG8C

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Mfr.Part #
XC17S30XLPDG8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM PROG C-TEMP 3.3V 8-DIP
Stock
7,384
In Stock :
7,384

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Reach Compliance Code :
Unknown
Output Characteristics :
3-STATE
Supply Voltage-Min (Vsup) :
3V
Termination :
Through Hole
Interface :
Serial
Terminal Pitch :
2.54mm
JESD-609 Code :
e3
Programmable Type :
OTP
Voltage - Supply :
3V~3.6V
Memory Size :
300kb
Base Part Number :
XC17S30XL
ECCN Code :
EAR99
Power Supplies :
3.3V
Operating Mode :
SYNCHRONOUS
Width :
7.62mm
Terminal Position :
Dual
Qualification Status :
Not Qualified
Supply Voltage :
3.3V
Number of Functions :
1
Terminal Finish :
Matte Tin (Sn)
REACH SVHC :
No SVHC
Standby Current-Max :
0.00005A
RoHS Status :
RoHS Compliant
Memory Type :
PROM
Height Seated (Max) :
4.5974mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Length :
9.3599mm
Mounting Type :
Through Hole
Number of Terminations :
8
Pin Count :
8
Supply Current-Max :
0.005mA
Memory Width :
1
Peak Reflow Temperature (Cel) :
250
Clock Frequency :
10MHz
Surface Mount :
No
Number of Pins :
8
Published :
1999
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
0°C~70°C
Supply Voltage-Max (Vsup) :
3.6V
I/O Type :
COMMON
Packaging :
Tube
Package / Case :
8-DIP (0.300, 7.62mm)
Datasheets
XC17S30XLPDG8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30XLPDG8C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17S30XL, Mounting Type:Through Hole, Number of Terminations:8, Number of Pins:8, Operating Temperature:0°C~70°C, Package / Case:8-DIP (0.300, 7.62mm), XC17S30XLPDG8C pinout, XC17S30XLPDG8C datasheet PDF, XC17S30XLPDG8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30XLPDG8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30XLPDG8C


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