XC17S30XLPD8C

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Mfr.Part #
XC17S30XLPD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM PROG C-TEMP 3.3V 8-DIP
Stock
37,636
In Stock :
37,636

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Standby Current-Max :
0.00005A
Number of Terminations :
8
Width :
7.62mm
Number of Pins :
8
Memory Size :
300kb
Surface Mount :
No
Published :
1999
Base Part Number :
XC17S30XL
Mounting Type :
Through Hole
Power Supplies :
3.3V
JESD-609 Code :
e0
RoHS Status :
Non-RoHS Compliant
Height Seated (Max) :
4.5974mm
Number of Functions :
1
Memory Width :
1
Supply Voltage :
3.3V
ECCN Code :
EAR99
Operating Temperature :
0°C~70°C
Terminal Position :
Dual
Terminal Pitch :
2.54mm
Package / Case :
8-DIP (0.300, 7.62mm)
Supply Voltage-Max (Vsup) :
3.6V
Voltage - Supply :
3V~3.6V
Supply Voltage-Min (Vsup) :
3V
Length :
9.3599mm
Output Characteristics :
3-STATE
Pin Count :
8
Lead Free :
Contains Lead
Packaging :
Tube
Supply Current-Max :
0.005mA
Programmable Type :
OTP
Qualification Status :
Not Qualified
I/O Type :
COMMON
Memory IC Type :
MEMORY CIRCUIT
Reach Compliance Code :
not_compliant
Clock Frequency :
10MHz
Moisture Sensitivity Level (MSL) :
Not Applicable
Operating Mode :
SYNCHRONOUS
Datasheets
XC17S30XLPD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30XLPD8C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:8, Number of Pins:8, Base Part Number:XC17S30XL, Mounting Type:Through Hole, Operating Temperature:0°C~70°C, Package / Case:8-DIP (0.300, 7.62mm), XC17S30XLPD8C pinout, XC17S30XLPD8C datasheet PDF, XC17S30XLPD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30XLPD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30XLPD8C


[Configuration Proms for FPGAs AMD Xilinx XC17S30XLPD8C] Overview

欢迎来到AMD Xilinx的XC17S30XLPD8C系列产品世界,这是一款专为您的FPGA设备提供高效编程解决方案的集成电路。无论您的应用场景是什么,这款IC PROM PROG CTEMP 3.3V 8DIP都能满足您的需求。通过先进的技术和可靠的性能,我们为您带来了一种优质的编程体验。

XC17S30XLPD8C Features

  • 高效编程:XC17S30XLPD8C提供了高效的编程能力,确保您的FPGA设备能够迅速、准确地完成编程任务。
  • 稳定性:我们的集成电路经过精心设计,具有出色的稳定性和可靠性,确保您的系统长时间稳定运行。
  • 广泛兼容性:XC17S30XLPD8C与各种FPGA设备兼容,为您提供了更大的灵活性和选择余地。
  • 温度范围:适用于广泛的温度范围,包括极端环境,确保在各种条件下都能正常运行。
  • 电压兼容性:支持3.3V电压,适用于多种电压环境下的应用。
  • 封装形式:8DIP封装,易于安装和集成到您的系统中。

XC17S30XLPD8C Applications

  • 工业自动化:XC17S30XLPD8C可应用于工业自动化设备的FPGA编程,确保设备在各种工业环境下稳定运行。
  • 通信设备:这款集成电路可用于通信设备的FPGA编程,确保通信网络的高效运行和可靠性。
  • 航空航天:XC17S30XLPD8C适用于航空航天领域的FPGA编程,确保航天器在极端环境下的可靠性和稳定性。
  • 医疗设备:在医疗设备中,XC17S30XLPD8C可用于FPGA编程,确保医疗设备的精确性和稳定性。
  • 汽车电子:这款集成电路可应用于汽车电子设备的FPGA编程,确保汽车系统的高效运行和安全性。
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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

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