XC17S30ASO20I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Density :

512 kb

RoHS Status :

Non-RoHS Compliant

Memory Size :

300kb

Radiation Hardening :

No

Supply Voltage-Min (Vsup) :

3V

Lead Free :

Contains Lead

Number of Pins :

20

Supply Voltage :

3.3V

Height Seated (Max) :

2.65mm

Base Part Number :

XC17S30

ECCN Code :

EAR99

Operating Supply Voltage :

3.3V

Width :

7.5mm

Time@Peak Reflow Temperature-Max (s) :

30

Standby Current-Max :

0.00005A

HTS Code :

8542.32.00.71

Mounting Type :

Surface Mount

Pbfree Code :

No

Organization :

336768X1

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Functions :

1

Number of Terminations :

20

Supply Voltage-Max (Vsup) :

3.6V

Length :

12.8mm

Published :

1999

Memory IC Type :

CONFIGURATION MEMORY

Memory Width :

1

Terminal Form :

Gull wing

Terminal Position :

Dual

Packaging :

Tube

JESD-609 Code :

e0

Package / Case :

20-SOIC (0.295, 7.50mm Width)

Output Characteristics :

3-STATE

Terminal Finish :

Tin/Lead (Sn85Pb15)

Operating Temperature :

-40°C~85°C

Terminal Pitch :

1.27mm

Programmable Type :

OTP

Peak Reflow Temperature (Cel) :

225

Supply Current-Max :

0.005mA

Surface Mount :

yes

I/O Type :

COMMON

Voltage - Supply :

3V~3.6V

Parallel/Serial :

Serial

Pin Count :

20