XC17S30APD8I

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Mfr.Part #
XC17S30APD8I
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 30000 I-TEMP 8-DIP
Stock
1,042
In Stock :
1,042

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Base Part Number :
XC17S30
Mounting Type :
Through Hole
Programmable Type :
OTP
Operating Supply Voltage :
3.3V
Supply Voltage :
3.3V
Standby Current-Max :
0.00005A
JESD-609 Code :
e0
ECCN Code :
EAR99
Pin Count :
8
Voltage - Supply :
3V~3.6V
Number of Pins :
8
Surface Mount :
No
Memory Width :
1
Terminal Pitch :
2.54mm
Package / Case :
8-DIP (0.300, 7.62mm)
Moisture Sensitivity Level (MSL) :
Not Applicable
RoHS Status :
Non-RoHS Compliant
Radiation Hardening :
No
Terminal Position :
Dual
Memory IC Type :
CONFIGURATION MEMORY
Supply Voltage-Min (Vsup) :
3V
Lead Free :
Contains Lead
Supply Current-Max :
0.005mA
Peak Reflow Temperature (Cel) :
225
Memory Size :
300kb
Number of Terminations :
8
Operating Temperature :
-40°C~85°C
Length :
9.3599mm
Published :
1999
Density :
512 kb
Height Seated (Max) :
4.5974mm
Output Characteristics :
3-STATE
Time@Peak Reflow Temperature-Max (s) :
30
Pbfree Code :
No
Supply Voltage-Max (Vsup) :
3.6V
Width :
7.62mm
Packaging :
Tube
I/O Type :
COMMON
Parallel/Serial :
Serial
Number of Functions :
1
Datasheets
XC17S30APD8I
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30APD8I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17S30, Mounting Type:Through Hole, Number of Pins:8, Package / Case:8-DIP (0.300, 7.62mm), Number of Terminations:8, Operating Temperature:-40°C~85°C, XC17S30APD8I pinout, XC17S30APD8I datasheet PDF, XC17S30APD8I amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30APD8I ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30APD8I


[Configuration Proms for FPGAs] Overview

Introducing the XC17S30APD8I by AMD Xilinx, a cutting-edge integrated circuit designed to elevate the performance and functionality of your FPGA-based systems. This IC PROM SER 30000 ITEMP 8DIP unit is meticulously crafted to meet the rigorous demands of modern electronics, ensuring seamless integration and optimal performance.

With its advanced features and robust design, this product is engineered to streamline your development process and enhance the efficiency of your applications. Whether you're working on complex computing tasks or intricate electronic designs, the XC17S30APD8I empowers you to unleash the full potential of your FPGA systems.

XC17S30APD8I Features

  • High-performance IC PROM SER
  • 30000 ITEMP
  • 8DIP package
  • Advanced design for seamless integration
  • Reliable performance under various operating conditions
  • Robust construction for durability and longevity
  • Optimized for FPGA-based systems

XC17S30APD8I Applications

  • Data Storage Systems: The XC17S30APD8I serves as an essential component in data storage systems, facilitating efficient data retrieval and processing in servers, storage arrays, and network appliances.
  • Communications Equipment: Integrating seamlessly into communication devices such as routers, switches, and modems, this IC PROM enhances the performance and reliability of data transmission and reception.
  • Industrial Automation: From programmable logic controllers (PLCs) to robotic systems, the XC17S30APD8I plays a pivotal role in industrial automation by enabling precise control and efficient operation of machinery and equipment.
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Shipping Cost

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