XC17S30APD8C

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Mfr.Part #
XC17S30APD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 30000 C-TEMP 8-DIP
Stock
1,428
In Stock :
1,428

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Parallel/Serial :
Serial
I/O Type :
COMMON
Terminal Pitch :
2.54mm
Peak Reflow Temperature (Cel) :
225
Density :
512 kb
Width :
7.62mm
Standby Current-Max :
0.00005A
Number of Pins :
8
Supply Voltage :
3.3V
Memory Size :
300kb
Packaging :
Tube
Length :
9.3599mm
Supply Voltage-Min (Vsup) :
3V
Lead Free :
Contains Lead
Pbfree Code :
No
Output Characteristics :
3-STATE
Base Part Number :
XC17S30
Radiation Hardening :
No
Surface Mount :
No
Supply Voltage-Max (Vsup) :
3.6V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Memory Width :
1
Operating Temperature :
0°C~70°C
Supply Current-Max :
0.005mA
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Type :
OTP
Mounting Type :
Through Hole
Published :
1999
Height Seated (Max) :
4.5974mm
ECCN Code :
EAR99
Terminal Position :
Dual
Memory IC Type :
CONFIGURATION MEMORY
Number of Functions :
1
JESD-609 Code :
e0
RoHS Status :
Non-RoHS Compliant
Package / Case :
8-DIP (0.300, 7.62mm)
Pin Count :
8
Operating Supply Voltage :
3.3V
Voltage - Supply :
3V~3.6V
Number of Terminations :
8
Datasheets
XC17S30APD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:8, Base Part Number:XC17S30, Operating Temperature:0°C~70°C, Mounting Type:Through Hole, Package / Case:8-DIP (0.300, 7.62mm), Number of Terminations:8, XC17S30APD8C pinout, XC17S30APD8C datasheet PDF, XC17S30APD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30APD8C


[Configuration Proms for FPGAs] Overview

Introducing the cutting-edge XC17S30APD8C by AMD Xilinx, a leading-edge Integrated Circuits solution designed to revolutionize your FPGA configuration needs. This IC PROM SER 30000 CTEMP 8DIP is meticulously crafted to deliver unparalleled performance and reliability in even the most demanding environments.

With its advanced features and robust construction, this product is engineered to meet the stringent requirements of modern industrial applications. Whether you're in the aerospace, automotive, telecommunications, or industrial automation sector, this versatile solution is poised to enhance your operational efficiency and drive innovation.

Experience seamless integration, superior functionality, and unparalleled durability with the XC17S30APD8C, your ultimate choice for FPGA configuration PROMs.

XC17S30APD8C Features

  • High-quality IC PROM SER 30000 CTEMP 8DIP
  • Precision-engineered by AMD Xilinx for exceptional performance
  • Designed to meet industry standards for reliability and durability
  • Wide operating temperature range for versatility in various environments
  • Compact 8DIP package for easy integration into existing systems
  • Efficient serial configuration interface for seamless operation
  • Robust construction for long-term reliability in demanding applications

XC17S30APD8C Applications

  • Industrial Automation: Employed in programmable logic controllers (PLCs) for configuring FPGAs in manufacturing processes, ensuring smooth operation and precise control.
  • Aerospace: Integrated into avionics systems for configuring FPGAs in flight control systems, enabling reliable performance and safety in aerospace applications.
  • Telecommunications: Utilized in network infrastructure equipment for configuring FPGAs in routers and switches, facilitating high-speed data processing and efficient network management.
  • Automotive: Incorporated into automotive electronics for configuring FPGAs in advanced driver assistance systems (ADAS), enhancing vehicle safety and performance.
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Shipping Cost

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