XC17S30APD8C
- Mfr.Part #
- XC17S30APD8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 30000 C-TEMP 8-DIP
- Stock
- 1,428
- In Stock :
- 1,428
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Parallel/Serial :
- Serial
- I/O Type :
- COMMON
- Terminal Pitch :
- 2.54mm
- Peak Reflow Temperature (Cel) :
- 225
- Density :
- 512 kb
- Width :
- 7.62mm
- Standby Current-Max :
- 0.00005A
- Number of Pins :
- 8
- Supply Voltage :
- 3.3V
- Memory Size :
- 300kb
- Packaging :
- Tube
- Length :
- 9.3599mm
- Supply Voltage-Min (Vsup) :
- 3V
- Lead Free :
- Contains Lead
- Pbfree Code :
- No
- Output Characteristics :
- 3-STATE
- Base Part Number :
- XC17S30
- Radiation Hardening :
- No
- Surface Mount :
- No
- Supply Voltage-Max (Vsup) :
- 3.6V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Memory Width :
- 1
- Operating Temperature :
- 0°C~70°C
- Supply Current-Max :
- 0.005mA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Type :
- OTP
- Mounting Type :
- Through Hole
- Published :
- 1999
- Height Seated (Max) :
- 4.5974mm
- ECCN Code :
- EAR99
- Terminal Position :
- Dual
- Memory IC Type :
- CONFIGURATION MEMORY
- Number of Functions :
- 1
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Pin Count :
- 8
- Operating Supply Voltage :
- 3.3V
- Voltage - Supply :
- 3V~3.6V
- Number of Terminations :
- 8
- Datasheets
- XC17S30APD8C

[Configuration Proms for FPGAs] Overview
Introducing the cutting-edge XC17S30APD8C by AMD Xilinx, a leading-edge Integrated Circuits solution designed to revolutionize your FPGA configuration needs. This IC PROM SER 30000 CTEMP 8DIP is meticulously crafted to deliver unparalleled performance and reliability in even the most demanding environments.
With its advanced features and robust construction, this product is engineered to meet the stringent requirements of modern industrial applications. Whether you're in the aerospace, automotive, telecommunications, or industrial automation sector, this versatile solution is poised to enhance your operational efficiency and drive innovation.
Experience seamless integration, superior functionality, and unparalleled durability with the XC17S30APD8C, your ultimate choice for FPGA configuration PROMs.
XC17S30APD8C Features
- High-quality IC PROM SER 30000 CTEMP 8DIP
- Precision-engineered by AMD Xilinx for exceptional performance
- Designed to meet industry standards for reliability and durability
- Wide operating temperature range for versatility in various environments
- Compact 8DIP package for easy integration into existing systems
- Efficient serial configuration interface for seamless operation
- Robust construction for long-term reliability in demanding applications
XC17S30APD8C Applications
- Industrial Automation: Employed in programmable logic controllers (PLCs) for configuring FPGAs in manufacturing processes, ensuring smooth operation and precise control.
- Aerospace: Integrated into avionics systems for configuring FPGAs in flight control systems, enabling reliable performance and safety in aerospace applications.
- Telecommunications: Utilized in network infrastructure equipment for configuring FPGAs in routers and switches, facilitating high-speed data processing and efficient network management.
- Automotive: Incorporated into automotive electronics for configuring FPGAs in advanced driver assistance systems (ADAS), enhancing vehicle safety and performance.
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