XC17S200APDG8I
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- Mfr.Part #
- XC17S200APDG8I
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 200K I-TEMP 8-DIP
- Stock
- 1
- In Stock ：
- 1
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Surface Mount :
- No
- Peak Reflow Temperature (Cel) :
- 250
- Programmable Type :
- OTP
- Standby Current-Max :
- 0.001A
- Number of Terminations :
- 8
- Supply Current-Max :
- 0.015mA
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tube
- Supply Voltage :
- 3.3V
- Width :
- 7.62mm
- Memory IC Type :
- CONFIGURATION MEMORY
- JESD-609 Code :
- e3
- Terminal Position :
- Dual
- Memory Size :
- 2MB
- Length :
- 9.3599mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 4.5974mm
- Mounting Type :
- Through Hole
- Operating Supply Voltage :
- 3.3V
- Number of Pins :
- 8
- Supply Voltage-Min (Vsup) :
- 3V
- Published :
- 1999
- Terminal Pitch :
- 2.54mm
- Supply Voltage-Max (Vsup) :
- 3.6V
- Parallel/Serial :
- Serial
- Pin Count :
- 8
- RoHS Status :
- RoHS Compliant
- Terminal Finish :
- Matte Tin (Sn)
- Voltage - Supply :
- 3V~3.6V
- ECCN Code :
- EAR99
- Radiation Hardening :
- No
- Number of Functions :
- 1
- Operating Temperature :
- -40°C~85°C
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Output Characteristics :
- 3-STATE
- Pbfree Code :
- yes
- Base Part Number :
- XC17S200A
- Memory Width :
- 1
- I/O Type :
- COMMON
- Datasheets
- XC17S200APDG8I
Configuration Proms for FPGAs AMD Xilinx XC17S200APDG8I Overview
The AMD Xilinx XC17S200APDG8I is a specialized Integrated Circuit (IC) from the family of Configuration PROMs designed for FPGA (Field-Programmable Gate Array) devices. This high-quality serial programmable read-only memory (PROM) is packaged in a compact 8-pin DIP (Dual In-line Package) and is designed to operate under industrial temperature ranges. It offers a robust solution for storing FPGA configuration algorithms, enabling quick and reliable FPGA configuration upon startup. The XC17S200APDG8I is crucial for developers looking to streamline the deployment of complex FPGA applications in various industrial environments. This product enhances system reliability and simplifies the design process, which is vital for B2B customers requiring efficient, high-volume deployments.
XC17S200APDG8I Features
This IC PROM features a 200K-bit storage capacity, ensuring sufficient space for essential configuration data and firmware for FPGAs. Its design for industrial temperature ranges makes it adaptable to challenging environmental conditions. The 8DIP casing facilitates easy installation and integration with a variety of board layouts, making it versatile for numerous applications. Additionally, its serial interface allows for simplified connection and data transfer, enhancing overall system efficiency and reducing setup time.
XC17S200APDG8I Applications
- Industrial Automation: Used in programmable logic controllers (PLCs) and other automation equipment to store configuration data, ensuring devices operate according to specific industrial protocols and standards.
- Telecommunications: Integral in communication equipment such as routers and switches for storing firmware that helps in handling complex network operations and configurations.
- Consumer Electronics: Applied in devices like set-top boxes and smart TVs, providing essential configuration data to manage user interfaces and customization features efficiently.
- Automotive: Utilized in automotive electronics for managing control systems and enhancing the functionality of vehicle management systems through dependable FPGA configurations.
- Medical Devices: Crucial for medical imaging systems and diagnostic equipment, where precise FPGA configurations uphold device functionality and reliability in critical healthcare environments.
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