XC17S200APD8C
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- Mfr.Part #
- XC17S200APD8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 200000 C-TEMP 8-DIP
- Stock
- 1,048
- In Stock ：
- 1,048
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Functions :
- 1
- Memory Size :
- 2MB
- Mounting Type :
- Through Hole
- Number of Pins :
- 8
- Published :
- 1999
- I/O Type :
- COMMON
- Standby Current-Max :
- 0.001A
- Lead Free :
- Contains Lead
- RoHS Status :
- Non-RoHS Compliant
- Memory IC Type :
- CONFIGURATION MEMORY
- Programmable Type :
- OTP
- Supply Voltage-Min (Vsup) :
- 3V
- JESD-609 Code :
- e0
- Voltage - Supply :
- 3V~3.6V
- Width :
- 7.62mm
- Operating Temperature :
- 0°C~70°C
- Supply Voltage-Max (Vsup) :
- 3.6V
- Output Characteristics :
- 3-STATE
- Radiation Hardening :
- No
- Terminal Pitch :
- 2.54mm
- Height Seated (Max) :
- 4.5974mm
- Supply Current-Max :
- 0.015mA
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Pin Count :
- 8
- Pbfree Code :
- No
- Base Part Number :
- XC17S200A
- Terminal Position :
- Dual
- Peak Reflow Temperature (Cel) :
- 225
- Operating Supply Voltage :
- 3.3V
- Length :
- 9.3599mm
- ECCN Code :
- EAR99
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Memory Width :
- 1
- Parallel/Serial :
- Serial
- Surface Mount :
- No
- Supply Voltage :
- 3.3V
- Packaging :
- Tube
- Number of Terminations :
- 8
- Datasheets
- XC17S200APD8C
Configuration Proms for FPGAs AMD Xilinx XC17S200APD8C Overview
The AMD Xilinx XC17S200APD8C represents a robust solution in the Configuration PROMs category, specifically designed to enhance the capabilities of field-programmable gate arrays (FPGAs). This IC PROM offers a serial interface and is tailored for critical applications requiring high reliability and performance under varying temperature conditions. With a dense 200,000-bit configuration memory, the XC17S200APD8C ensures a swift and secure FPGA configuration, making it an indispensable tool for developers working with AMD Xilinx FPGA platforms. This device, housed in an 8-DIP package, supports a wide temperature range, ensuring its functionality across diverse environmental conditions, making the Configuration Proms for FPGAs AMD Xilinx XC17S200APD8C a preferred choice for demanding applications.
XC17S200APD8C Features
- 200,000-bit storage capacity for FPGA configuration data.
- Serial interface facilitating streamlined configuration loading.
- CTEMP 8DIP packaging to withstand diverse environmental conditions.
- Support for broad temperature ranges, suitable for industrial applications.
- Designed for easy integration with AMD Xilinx FPGAs.
XC17S200APD8C Applications
- Telecommunications Equipment: Utilized in routers and switches to manage data flow efficiently through programmable logic.
- Automotive Systems: Enhances the functionality of automotive electronics by providing adaptable logic for real-time system updates and diagnostics.
- Consumer Electronics: Employs in devices such as smart TVs and gaming consoles to enable complex user interfaces and high-speed processing.
- Industrial Automation: Used in control systems for manufacturing lines, enhancing operational flexibility and machine intelligence.
- Medical Devices: Crucial in medical imaging systems where FPGA programming helps in processing complex visualization algorithms.
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