XC17S15APD8C

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Mfr.Part #
XC17S15APD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 5000 C-TEMP 8-DIP
Stock
8,800
In Stock :
8,800

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
JESD-609 Code :
e0
Pbfree Code :
No
I/O Type :
COMMON
Voltage - Supply :
3V~3.6V
Memory Size :
150kb
Standby Current-Max :
0.00005A
Base Part Number :
XC17S15A
Lead Free :
Contains Lead
Memory Width :
1
Parallel/Serial :
Serial
Programmable Type :
OTP
Organization :
197696X1
Surface Mount :
No
Packaging :
Tube
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
8
Number of Functions :
1
RoHS Status :
Non-RoHS Compliant
Width :
7.62mm
Terminal Position :
Dual
Number of Pins :
8
Operating Temperature :
0°C~70°C
Package / Case :
8-DIP (0.300, 7.62mm)
Terminal Pitch :
2.54mm
Supply Voltage-Max (Vsup) :
3.6V
Peak Reflow Temperature (Cel) :
225
Pin Count :
8
Output Characteristics :
3-STATE
Operating Supply Voltage :
3.3V
Supply Voltage :
3.3V
Supply Voltage-Min (Vsup) :
3V
Density :
512 kb
Radiation Hardening :
No
Moisture Sensitivity Level (MSL) :
Not Applicable
Length :
9.3599mm
Supply Current-Max :
0.005mA
ECCN Code :
EAR99
Published :
1999
Height Seated (Max) :
4.5974mm
Mounting Type :
Through Hole
Memory IC Type :
CONFIGURATION MEMORY
Datasheets
XC17S15APD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17S15A, Number of Terminations:8, Number of Pins:8, Operating Temperature:0°C~70°C, Package / Case:8-DIP (0.300, 7.62mm), Mounting Type:Through Hole, XC17S15APD8C pinout, XC17S15APD8C datasheet PDF, XC17S15APD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S15APD8C


[Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C] Overview

Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, the XC17S15APD8C. Designed to meet the demanding requirements of modern electronic systems, these integrated circuits (ICs) redefine versatility and reliability in programmable logic devices.

Boasting a robust construction and advanced technology, the XC17S15APD8C serves as the cornerstone for seamless integration within various electronic applications. Whether you're delving into telecommunications, industrial automation, or aerospace, this high-performance IC promises unparalleled performance and adaptability.

Explore a world of limitless possibilities with AMD Xilinx's XC17S15APD8C, where innovation meets excellence.

[XC17S15APD8C] Features

  • Highly reliable PROM technology
  • 5000-cycle endurance for extended usage
  • Wide operating temperature range (-40°C to +85°C)
  • Compact 8DIP package for space-efficient designs
  • Low power consumption for energy-efficient operation

[XC17S15APD8C] Applications

  • Telecommunications: Utilized in base stations and network infrastructure for FPGA configuration, ensuring seamless data transmission and reception.
  • Industrial Automation: Integrated into PLCs (Programmable Logic Controllers) to facilitate real-time control and monitoring of manufacturing processes in diverse industrial settings.
  • Aerospace: Employed in avionics systems for FPGA configuration, enabling enhanced performance and reliability in critical flight operations.
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Shipping Cost

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