XC17S150ASO20C
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- Mfr.Part #
- XC17S150ASO20C
- Manufacturer
- AMD Xilinx
- Package / Case
- 20-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC PROM SER 150000 C-TEMP 20SOIC
- Stock
- 8,577
- In Stock ：
- 8,577
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Lead Free :
- Contains Lead
- Organization :
- 1040096X1
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Memory Size :
- 1.5MB
- Supply Current-Max :
- 0.005mA
- Voltage - Supply :
- 3V~3.6V
- Published :
- 1999
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 225
- Standby Current-Max :
- 0.00005A
- Number of Functions :
- 1
- Memory IC Type :
- CONFIGURATION MEMORY
- I/O Type :
- COMMON
- Number of Pins :
- 20
- Terminal Position :
- Dual
- HTS Code :
- 8542.32.00.71
- Terminal Form :
- Gull wing
- Programmable Type :
- OTP
- Parallel/Serial :
- Serial
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Base Part Number :
- XC17S150A
- Operating Supply Voltage :
- 3.3V
- Package / Case :
- 20-SOIC (0.295, 7.50mm Width)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage-Max (Vsup) :
- 3.6V
- Width :
- 7.5mm
- Supply Voltage-Min (Vsup) :
- 3V
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Length :
- 12.8mm
- Height Seated (Max) :
- 2.65mm
- Pbfree Code :
- No
- Number of Terminations :
- 20
- Pin Count :
- 20
- Density :
- 1 Mb
- Operating Temperature :
- 0°C~70°C
- Mounting Type :
- Surface Mount
- Memory Width :
- 1
- ECCN Code :
- EAR99
- Supply Voltage :
- 3.3V
- Terminal Pitch :
- 1.27mm
- JESD-609 Code :
- e0
- Output Characteristics :
- 3-STATE
- Datasheets
- XC17S150ASO20C
Configuration Proms for FPGAs AMD Xilinx XC17S150ASO20C Overview
Introducing the cutting-edge Configuration Proms for FPGAs from AMD Xilinx, the XC17S150ASO20C. Designed with precision engineering and advanced technology, these integrated circuits redefine the standards for programmable logic devices. Offering a vast array of features and unparalleled performance, they empower businesses to unlock new possibilities in their digital designs.
AMD Xilinx XC17S150ASO20C brings forth a seamless integration of innovative design and superior functionality, catering to the evolving needs of modern industries. With its robust construction and reliable performance, it stands as the epitome of excellence in the realm of electronic components.
XC17S150ASO20C Features
- High-density PROM cells for efficient configuration storage
- Exceptional reliability and endurance for long-term usage
- Wide operating temperature range (CTEMP) for versatile deployment
- Compact 20SOIC package for space-saving designs
- Seamless compatibility with FPGA systems for effortless integration
- Industry-leading quality assurance and testing standards
XC17S150ASO20C Applications
- Embedded Systems: The XC17S150ASO20C serves as a critical component in embedded systems, facilitating seamless configuration updates and enhancing system performance. Its high-density PROM cells ensure reliable storage of configuration data, making it ideal for applications requiring stable and efficient operation.
- Telecommunication Equipment: In telecommunications, reliability is paramount. The XC17S150ASO20C excels in this regard, offering exceptional endurance and wide temperature tolerance. Whether deployed in routers, switches, or base stations, this IC ensures uninterrupted functionality even in harsh environmental conditions.
- Industrial Automation: The rugged design and compact form factor of the XC17S150ASO20C make it well-suited for industrial automation applications. From PLCs to robotic control systems, this versatile device provides the reliability and performance necessary to drive efficiency and productivity in manufacturing environments.
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