XC17S10XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Organization :

95752X1

Length :

4.9mm

Peak Reflow Temperature (Cel) :

260

RoHS Status :

RoHS Compliant

Memory Density :

95752 bit

Supply Voltage-Min (Vsup) :

3V

Mounting Type :

Surface Mount

Packaging :

Tray

Qualification Status :

Not Qualified

Power Supplies :

3.3V

Supply Voltage-Max (Vsup) :

3.6V

Base Part Number :

XC17S10XL

Terminal Finish :

Matte Tin (Sn)

Number of Functions :

1

Supply Voltage :

3.3V

Memory Size :

100kB

Terminal Pitch :

1.27mm

Package / Case :

8-SOIC (0.154, 3.90mm Width)

Height Seated (Max) :

1.2mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

I/O Type :

COMMON

Voltage - Supply :

3V~3.6V

Time@Peak Reflow Temperature-Max (s) :

30

Number of Pins :

8

Supply Current-Max :

0.005mA

Memory IC Type :

MEMORY CIRCUIT

Number of Terminations :

8

Programmable Type :

OTP

Operating Temperature :

-40°C~85°C

ECCN Code :

EAR99

Width :

3.9mm

Clock Frequency :

10MHz

Standby Current-Max :

0.00005A

Published :

1999

Pin Count :

8

JESD-609 Code :

e3

Operating Mode :

SYNCHRONOUS

Output Characteristics :

3-STATE

Terminal Position :

Dual

Terminal Form :

Gull wing

Surface Mount :

yes

Memory Width :

1