XC17S10XLVOG8I

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Mfr.Part #
XC17S10XLVOG8I
Manufacturer
AMD Xilinx
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC PROM SERIEAL 10K 8-SOIC
Stock
13,086
In Stock :
13,086

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Organization :
95752X1
Length :
4.9mm
Peak Reflow Temperature (Cel) :
260
RoHS Status :
RoHS Compliant
Memory Density :
95752 bit
Supply Voltage-Min (Vsup) :
3V
Mounting Type :
Surface Mount
Packaging :
Tray
Qualification Status :
Not Qualified
Power Supplies :
3.3V
Supply Voltage-Max (Vsup) :
3.6V
Base Part Number :
XC17S10XL
Terminal Finish :
Matte Tin (Sn)
Number of Functions :
1
Supply Voltage :
3.3V
Memory Size :
100kB
Terminal Pitch :
1.27mm
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Height Seated (Max) :
1.2mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
I/O Type :
COMMON
Voltage - Supply :
3V~3.6V
Time@Peak Reflow Temperature-Max (s) :
30
Number of Pins :
8
Supply Current-Max :
0.005mA
Memory IC Type :
MEMORY CIRCUIT
Number of Terminations :
8
Programmable Type :
OTP
Operating Temperature :
-40°C~85°C
ECCN Code :
EAR99
Width :
3.9mm
Clock Frequency :
10MHz
Standby Current-Max :
0.00005A
Published :
1999
Pin Count :
8
JESD-609 Code :
e3
Operating Mode :
SYNCHRONOUS
Output Characteristics :
3-STATE
Terminal Position :
Dual
Terminal Form :
Gull wing
Surface Mount :
yes
Memory Width :
1
Datasheets
XC17S10XLVOG8I
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S10XLVOG8I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC17S10XL, Package / Case:8-SOIC (0.154, 3.90mm Width), Number of Pins:8, Number of Terminations:8, Operating Temperature:-40°C~85°C, XC17S10XLVOG8I pinout, XC17S10XLVOG8I datasheet PDF, XC17S10XLVOG8I amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S10XLVOG8I ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S10XLVOG8I


[Configuration Proms for FPGAs AMD Xilinx XC17S10XLVOG8I] Overview

Introducing the cutting-edge Configuration Proms for FPGAs, meticulously crafted by AMD Xilinx, the pioneer in semiconductor innovation. The XC17S10XLVOG8I stands as a testament to relentless engineering excellence, offering unrivaled performance and versatility in the realm of integrated circuits.

Designed to meet the demanding requirements of modern electronics, this IC PROM SERIEAL 10K 8SOIC unit redefines efficiency and reliability. Its compact 8SOIC package houses a powerhouse of functionality, setting new benchmarks in the industry.

Experience seamless integration and unparalleled functionality as you embark on a journey of technological advancement with AMD Xilinx's XC17S10XLVOG8I. From concept to execution, empower your projects with the pinnacle of semiconductor innovation.

XC17S10XLVOG8I Features

  • Highly Efficient: Leveraging advanced semiconductor technologies, the XC17S10XLVOG8I delivers unmatched efficiency, ensuring optimal performance in every application.
  • Robust Design: Built to withstand the rigors of industrial environments, this IC PROM SERIEAL 10K 8SOIC unit boasts a robust design that guarantees long-term reliability and durability.
  • Flexible Configuration: Tailor-made for FPGAs, the XC17S10XLVOG8I offers flexible configuration options, empowering engineers to optimize their designs for maximum efficiency and functionality.
  • Compact Form Factor: With its compact 8SOIC package, this product enables space-efficient designs without compromising on performance, making it ideal for applications with size constraints.
  • Easy Integration: Seamlessly integrate the XC17S10XLVOG8I into your projects with plug-and-play compatibility, simplifying the development process and reducing time-to-market.

XC17S10XLVOG8I Applications

  • Data Processing Systems: Harness the power of the XC17S10XLVOG8I to optimize data processing systems, ensuring lightning-fast performance and unparalleled efficiency in data-intensive applications such as servers and networking equipment.
  • This product is seamlessly integrated into data processing systems, facilitating rapid data transmission and processing, thereby enhancing overall system performance and efficiency.

  • Embedded Systems: Elevate the capabilities of embedded systems with the XC17S10XLVOG8I, enabling seamless integration and enhanced functionality in applications such as automotive electronics, industrial control systems, and consumer electronics.
  • By incorporating this product into embedded systems, engineers can unlock new possibilities for innovation and differentiation, delivering superior performance and reliability to end-users.

  • Communication Infrastructure: Revolutionize communication infrastructure with the XC17S10XLVOG8I, optimizing the performance and reliability of telecommunications equipment, wireless base stations, and network switches.
  • This product plays a critical role in enhancing the efficiency and reliability of communication infrastructure, enabling seamless connectivity and uninterrupted communication services for users worldwide.

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Payment Method

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IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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