XC17S10XLVO8C
- Mfr.Part #
- XC17S10XLVO8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC 3V PROM SER 10K 8-SOIC
- Stock
- 40,017
- In Stock :
- 40,017
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Memory Width :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Clock Frequency :
- 10MHz
- Terminal Form :
- Gull wing
- Number of Terminations :
- 8
- Terminal Pitch :
- 1.27mm
- Power Supplies :
- 3.3V
- Lead Free :
- Contains Lead
- Terminal Position :
- Dual
- Published :
- 1999
- Height Seated (Max) :
- 1.2mm
- Base Part Number :
- XC17S10XL
- JESD-609 Code :
- e0
- Pbfree Code :
- No
- Mounting Type :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 3.6V
- Programmable Type :
- OTP
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 3.3V
- Length :
- 4.9mm
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 3V
- Number of Pins :
- 8
- Memory Density :
- 95752 bit
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Operating Mode :
- SYNCHRONOUS
- Memory IC Type :
- MEMORY CIRCUIT
- Number of Functions :
- 1
- Voltage - Supply :
- 3V~3.6V
- Packaging :
- Tube
- Pin Count :
- 8
- Output Characteristics :
- 3-STATE
- Supply Current-Max :
- 0.005mA
- Width :
- 3.9mm
- ECCN Code :
- EAR99
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- 0°C~70°C
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Organization :
- 95752X1
- Standby Current-Max :
- 0.00005A
- I/O Type :
- COMMON
- Memory Size :
- 100kB
- Datasheets
- XC17S10XLVO8C

[Configuration Proms for FPGAs] Overview
Welcome to the forefront of semiconductor innovation with AMD Xilinx's XC17S10XLVO8C, a cutting-edge Integrated Circuit (IC) designed to revolutionize the field of Field-Programmable Gate Arrays (FPGAs). This 3V PROM SER 10K 8SOIC device represents a pinnacle in programmable logic technology, offering unparalleled flexibility and efficiency in configuration management for FPGA systems.
With its compact 8SOIC form factor and robust 3V operation, the XC17S10XLVO8C empowers engineers and developers to optimize their FPGA deployments with ease. Whether you're a seasoned professional or a budding enthusiast, this IC delivers the performance and reliability you need to bring your FPGA projects to life.
Experience the future of FPGA configuration management – experience the XC17S10XLVO8C.
XC17S10XLVO8C Features
- Advanced 3V PROM technology for reliable configuration storage
- Serious 10K endurance for enduring performance in demanding environments
- Compact 8SOIC package for seamless integration into FPGA designs
- Efficient serial interface for fast and hassle-free configuration updates
- Robust design for dependable operation in industrial applications
XC17S10XLVO8C Applications
- Field-Programmable Gate Array (FPGA) Configuration Management: The XC17S10XLVO8C is ideally suited for storing and managing configuration data in FPGA-based systems. Its high endurance and reliable performance make it the perfect choice for ensuring smooth operation and seamless updates in FPGA deployments across various industries.
- Embedded Systems: Integrate the XC17S10XLVO8C into embedded systems requiring flexible configuration options. From industrial automation to telecommunications, this IC offers the versatility and reliability needed to meet the demands of modern embedded applications.
- Communications Infrastructure: Enhance the performance and reliability of communication infrastructure with the XC17S10XLVO8C. Whether used in network switches, routers, or wireless base stations, this IC provides efficient configuration management to ensure optimal network operation and seamless scalability.
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