XC17S10XLVO8C
- Mfr.Part #
- XC17S10XLVO8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC 3V PROM SER 10K 8-SOIC
- Stock
- 40,017
- In Stock :
- 40,017
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Lead Free :
- Contains Lead
- Supply Voltage-Max (Vsup) :
- 3.6V
- Clock Frequency :
- 10MHz
- Operating Mode :
- SYNCHRONOUS
- Memory Size :
- 100kB
- Voltage - Supply :
- 3V~3.6V
- Length :
- 4.9mm
- Pbfree Code :
- No
- Published :
- 1999
- Supply Current-Max :
- 0.005mA
- Number of Pins :
- 8
- Memory IC Type :
- MEMORY CIRCUIT
- Surface Mount :
- yes
- Number of Terminations :
- 8
- Pin Count :
- 8
- Standby Current-Max :
- 0.00005A
- Terminal Form :
- Gull wing
- Reach Compliance Code :
- not_compliant
- Base Part Number :
- XC17S10XL
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Organization :
- 95752X1
- ECCN Code :
- EAR99
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 3.3V
- Width :
- 3.9mm
- Operating Temperature :
- 0°C~70°C
- Terminal Position :
- Dual
- Supply Voltage-Min (Vsup) :
- 3V
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- I/O Type :
- COMMON
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Output Characteristics :
- 3-STATE
- Power Supplies :
- 3.3V
- Packaging :
- Tube
- Memory Density :
- 95752 bit
- Programmable Type :
- OTP
- Height Seated (Max) :
- 1.2mm
- Memory Width :
- 1
- Number of Functions :
- 1
- Datasheets
- XC17S10XLVO8C

[Configuration Proms for FPGAs] Overview
Welcome to the forefront of semiconductor innovation with AMD Xilinx's XC17S10XLVO8C, a cutting-edge Integrated Circuit (IC) designed to revolutionize the field of Field-Programmable Gate Arrays (FPGAs). This 3V PROM SER 10K 8SOIC device represents a pinnacle in programmable logic technology, offering unparalleled flexibility and efficiency in configuration management for FPGA systems.
With its compact 8SOIC form factor and robust 3V operation, the XC17S10XLVO8C empowers engineers and developers to optimize their FPGA deployments with ease. Whether you're a seasoned professional or a budding enthusiast, this IC delivers the performance and reliability you need to bring your FPGA projects to life.
Experience the future of FPGA configuration management – experience the XC17S10XLVO8C.
XC17S10XLVO8C Features
- Advanced 3V PROM technology for reliable configuration storage
- Serious 10K endurance for enduring performance in demanding environments
- Compact 8SOIC package for seamless integration into FPGA designs
- Efficient serial interface for fast and hassle-free configuration updates
- Robust design for dependable operation in industrial applications
XC17S10XLVO8C Applications
- Field-Programmable Gate Array (FPGA) Configuration Management: The XC17S10XLVO8C is ideally suited for storing and managing configuration data in FPGA-based systems. Its high endurance and reliable performance make it the perfect choice for ensuring smooth operation and seamless updates in FPGA deployments across various industries.
- Embedded Systems: Integrate the XC17S10XLVO8C into embedded systems requiring flexible configuration options. From industrial automation to telecommunications, this IC offers the versatility and reliability needed to meet the demands of modern embedded applications.
- Communications Infrastructure: Enhance the performance and reliability of communication infrastructure with the XC17S10XLVO8C. Whether used in network switches, routers, or wireless base stations, this IC provides efficient configuration management to ensure optimal network operation and seamless scalability.
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