XC17S10XLPDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Memory Size :

100kB

JESD-609 Code :

e3

Reach Compliance Code :

Unknown

Width :

7.62mm

Mounting Type :

Through Hole

Memory Width :

1

Number of Terminations :

8

Supply Voltage-Min (Vsup) :

3V

Published :

1999

ECCN Code :

EAR99

Height Seated (Max) :

4.5974mm

Organization :

95752X1

Surface Mount :

No

Clock Frequency :

10MHz

Power Supplies :

3.3V

Voltage - Supply :

3V~3.6V

Operating Mode :

SYNCHRONOUS

Qualification Status :

Not Qualified

Memory IC Type :

MEMORY CIRCUIT

Peak Reflow Temperature (Cel) :

250

Time@Peak Reflow Temperature-Max (s) :

30

Packaging :

Tube

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Position :

Dual

RoHS Status :

RoHS Compliant

I/O Type :

COMMON

Supply Voltage-Max (Vsup) :

3.6V

Pin Count :

8

Operating Temperature :

0°C~70°C

Package / Case :

8-DIP (0.300, 7.62mm)

Supply Current-Max :

0.005mA

Number of Functions :

1

Length :

9.3599mm

Standby Current-Max :

0.00005A

Base Part Number :

XC17S10XL

Programmable Type :

OTP

Number of Pins :

8

Terminal Finish :

Matte Tin (Sn)

Supply Voltage :

3.3V

Output Characteristics :

3-STATE

Terminal Pitch :

2.54mm

Memory Density :

95752 bit