XC17S10XLPDG8C
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- Mfr.Part #
- XC17S10XLPDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Stock
- 770
- In Stock ：
- 770
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Standby Current-Max :
- 0.00005A
- Power Supplies :
- 3.3V
- Memory Width :
- 1
- RoHS Status :
- RoHS Compliant
- Published :
- 1999
- JESD-609 Code :
- e3
- Organization :
- 95752X1
- Programmable Type :
- OTP
- Supply Voltage-Min (Vsup) :
- 3V
- Number of Functions :
- 1
- Memory IC Type :
- MEMORY CIRCUIT
- Number of Pins :
- 8
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Terminations :
- 8
- Height Seated (Max) :
- 4.5974mm
- Packaging :
- Tube
- Base Part Number :
- XC17S10XL
- Supply Voltage :
- 3.3V
- Pin Count :
- 8
- Memory Density :
- 95752 bit
- Width :
- 7.62mm
- Operating Temperature :
- 0°C~70°C
- Operating Mode :
- SYNCHRONOUS
- Terminal Finish :
- Matte Tin (Sn)
- Output Characteristics :
- 3-STATE
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Clock Frequency :
- 10MHz
- Length :
- 9.3599mm
- Mounting Type :
- Through Hole
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Peak Reflow Temperature (Cel) :
- 250
- ECCN Code :
- EAR99
- Memory Size :
- 100kB
- Terminal Position :
- Dual
- Terminal Pitch :
- 2.54mm
- Supply Current-Max :
- 0.005mA
- Qualification Status :
- Not Qualified
- Surface Mount :
- No
- Reach Compliance Code :
- Unknown
- Voltage - Supply :
- 3V~3.6V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- I/O Type :
- COMMON
- Datasheets
- XC17S10XLPDG8C
Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C Overview
The Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C is an essential component designed for high-reliability, non-volatile storage of programmable FPGA configurations. This device supports a 3.3V power supply and is packaged in an 8-pin DIP, offering a compact solution for embedded applications. Its robust design ensures that it operates effectively under commercial temperature ranges, making it a versatile choice for a variety of industrial applications. The ease of programming and integration with AMD Xilinx FPGA platforms make it particularly appealing for developers looking to streamline their hardware setups and ensure consistent performance in their digital and computing solutions.
XC17S10XLPDG8C Features
- Non-volatile PROM: Retains FPGA configuration data even after power is turned off.
- Low voltage operation at 3.3V: Suitable for modern low-power electronics.
- Commercial temperature range: Reliable operation in diverse environmental conditions.
- Compact 8-pin DIP package: Easy to install and integrate into existing systems.
- Compatible with AMD Xilinx FPGAs: Seamless integration for FPGA designs.
XC17S10XLPDG8C Applications
- Consumer Electronics: Used in devices like smart TVs and gaming consoles where stable FPGA configurations are critical.
- Automotive Systems: Integrates into automotive electronics for managing complex FPGA-based applications such as advanced driver-assistance systems (ADAS).
- Industrial Automation: Provides reliable configuration storage in harsh industrial environments for equipment such as programmable logic controllers.
- Telecommunications: Essential for communication infrastructure equipment, enabling robust FPGA configurations that support high-speed data transmission.
- Aerospace and Defense: Offers dependable configuration storage solutions for aerospace applications where precision and reliability are paramount.
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