XC17S10XLPDG8C
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- Mfr.Part #
- XC17S10XLPDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Stock
- 770
- In Stock ：
- 770
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Programmable Type :
- OTP
- Surface Mount :
- No
- Number of Functions :
- 1
- Length :
- 9.3599mm
- Peak Reflow Temperature (Cel) :
- 250
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 2.54mm
- Number of Pins :
- 8
- Supply Voltage-Max (Vsup) :
- 3.6V
- Standby Current-Max :
- 0.00005A
- Pin Count :
- 8
- Terminal Position :
- Dual
- Organization :
- 95752X1
- Base Part Number :
- XC17S10XL
- Memory Width :
- 1
- Number of Terminations :
- 8
- Voltage - Supply :
- 3V~3.6V
- Published :
- 1999
- RoHS Status :
- RoHS Compliant
- Power Supplies :
- 3.3V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Supply Voltage :
- 3.3V
- I/O Type :
- COMMON
- Memory Size :
- 100kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e3
- Terminal Finish :
- Matte Tin (Sn)
- Height Seated (Max) :
- 4.5974mm
- Operating Mode :
- SYNCHRONOUS
- Memory IC Type :
- MEMORY CIRCUIT
- Clock Frequency :
- 10MHz
- Supply Voltage-Min (Vsup) :
- 3V
- Output Characteristics :
- 3-STATE
- Memory Density :
- 95752 bit
- Width :
- 7.62mm
- Packaging :
- Tube
- Mounting Type :
- Through Hole
- ECCN Code :
- EAR99
- Reach Compliance Code :
- Unknown
- Supply Current-Max :
- 0.005mA
- Operating Temperature :
- 0°C~70°C
- Datasheets
- XC17S10XLPDG8C
Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C Overview
The Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C is an essential component designed for high-reliability, non-volatile storage of programmable FPGA configurations. This device supports a 3.3V power supply and is packaged in an 8-pin DIP, offering a compact solution for embedded applications. Its robust design ensures that it operates effectively under commercial temperature ranges, making it a versatile choice for a variety of industrial applications. The ease of programming and integration with AMD Xilinx FPGA platforms make it particularly appealing for developers looking to streamline their hardware setups and ensure consistent performance in their digital and computing solutions.
XC17S10XLPDG8C Features
- Non-volatile PROM: Retains FPGA configuration data even after power is turned off.
- Low voltage operation at 3.3V: Suitable for modern low-power electronics.
- Commercial temperature range: Reliable operation in diverse environmental conditions.
- Compact 8-pin DIP package: Easy to install and integrate into existing systems.
- Compatible with AMD Xilinx FPGAs: Seamless integration for FPGA designs.
XC17S10XLPDG8C Applications
- Consumer Electronics: Used in devices like smart TVs and gaming consoles where stable FPGA configurations are critical.
- Automotive Systems: Integrates into automotive electronics for managing complex FPGA-based applications such as advanced driver-assistance systems (ADAS).
- Industrial Automation: Provides reliable configuration storage in harsh industrial environments for equipment such as programmable logic controllers.
- Telecommunications: Essential for communication infrastructure equipment, enabling robust FPGA configurations that support high-speed data transmission.
- Aerospace and Defense: Offers dependable configuration storage solutions for aerospace applications where precision and reliability are paramount.
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