XC17S10XLPDG8C

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Mfr.Part #
XC17S10XLPDG8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM PROG C-TEMP 3.3V 8-DIP
Stock
770
In Stock :
770

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Programmable Type :
OTP
Supply Current-Max :
0.005mA
Memory Width :
1
Time@Peak Reflow Temperature-Max (s) :
30
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Functions :
1
Terminal Pitch :
2.54mm
Height Seated (Max) :
4.5974mm
Peak Reflow Temperature (Cel) :
250
Terminal Position :
Dual
Width :
7.62mm
Voltage - Supply :
3V~3.6V
Organization :
95752X1
Output Characteristics :
3-STATE
Reach Compliance Code :
Unknown
Package / Case :
8-DIP (0.300, 7.62mm)
Published :
1999
Supply Voltage-Min (Vsup) :
3V
Supply Voltage-Max (Vsup) :
3.6V
I/O Type :
COMMON
Qualification Status :
Not Qualified
Number of Terminations :
8
JESD-609 Code :
e3
Clock Frequency :
10MHz
Packaging :
Tube
Terminal Finish :
Matte Tin (Sn)
Base Part Number :
XC17S10XL
Pin Count :
8
Standby Current-Max :
0.00005A
ECCN Code :
EAR99
Number of Pins :
8
RoHS Status :
RoHS Compliant
Operating Mode :
SYNCHRONOUS
Memory Density :
95752 bit
Power Supplies :
3.3V
Memory IC Type :
MEMORY CIRCUIT
Length :
9.3599mm
Operating Temperature :
0°C~70°C
Mounting Type :
Through Hole
Surface Mount :
No
Memory Size :
100kB
Supply Voltage :
3.3V
Datasheets
XC17S10XLPDG8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:8-DIP (0.300, 7.62mm), Number of Terminations:8, Base Part Number:XC17S10XL, Number of Pins:8, Operating Temperature:0°C~70°C, Mounting Type:Through Hole, XC17S10XLPDG8C pinout, XC17S10XLPDG8C datasheet PDF, XC17S10XLPDG8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S10XLPDG8C


Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C Overview

The Configuration Proms for FPGAs AMD Xilinx XC17S10XLPDG8C is an essential component designed for high-reliability, non-volatile storage of programmable FPGA configurations. This device supports a 3.3V power supply and is packaged in an 8-pin DIP, offering a compact solution for embedded applications. Its robust design ensures that it operates effectively under commercial temperature ranges, making it a versatile choice for a variety of industrial applications. The ease of programming and integration with AMD Xilinx FPGA platforms make it particularly appealing for developers looking to streamline their hardware setups and ensure consistent performance in their digital and computing solutions.

XC17S10XLPDG8C Features

  • Non-volatile PROM: Retains FPGA configuration data even after power is turned off.
  • Low voltage operation at 3.3V: Suitable for modern low-power electronics.
  • Commercial temperature range: Reliable operation in diverse environmental conditions.
  • Compact 8-pin DIP package: Easy to install and integrate into existing systems.
  • Compatible with AMD Xilinx FPGAs: Seamless integration for FPGA designs.

XC17S10XLPDG8C Applications

  • Consumer Electronics: Used in devices like smart TVs and gaming consoles where stable FPGA configurations are critical.
  • Automotive Systems: Integrates into automotive electronics for managing complex FPGA-based applications such as advanced driver-assistance systems (ADAS).
  • Industrial Automation: Provides reliable configuration storage in harsh industrial environments for equipment such as programmable logic controllers.
  • Telecommunications: Essential for communication infrastructure equipment, enabling robust FPGA configurations that support high-speed data transmission.
  • Aerospace and Defense: Offers dependable configuration storage solutions for aerospace applications where precision and reliability are paramount.
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