XC17S100ASO20C

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Mfr.Part #
XC17S100ASO20C
Manufacturer
AMD Xilinx
Package / Case
20-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC PROM SER 100000 C-TEMP 20SOIC
Stock
8,084
In Stock :
8,084

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
I/O Type :
COMMON
Programmable Type :
OTP
Memory IC Type :
CONFIGURATION MEMORY
Width :
7.5mm
Base Part Number :
XC17S100A
Number of Functions :
1
Pin Count :
20
Pbfree Code :
No
Peak Reflow Temperature (Cel) :
225
Package / Case :
20-SOIC (0.295, 7.50mm Width)
Lead Free :
Contains Lead
Organization :
781216X1
RoHS Status :
Non-RoHS Compliant
Terminal Form :
Gull wing
Published :
1999
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
JESD-609 Code :
e0
Supply Current-Max :
0.015mA
Radiation Hardening :
No
Terminal Pitch :
1.27mm
Number of Terminations :
20
Output Characteristics :
3-STATE
ECCN Code :
EAR99
Standby Current-Max :
0.001A
Mounting Type :
Surface Mount
Number of Pins :
20
Density :
1 Mb
Supply Voltage-Max (Vsup) :
3.6V
Memory Width :
1
Terminal Finish :
Tin/Lead (Sn85Pb15)
Operating Supply Voltage :
3.3V
Supply Voltage :
3.3V
Terminal Position :
Dual
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage-Min (Vsup) :
3V
Length :
12.8mm
Voltage - Supply :
3V~3.6V
Surface Mount :
yes
HTS Code :
8542.32.00.71
Packaging :
Tube
Operating Temperature :
0°C~70°C
Height Seated (Max) :
2.65mm
Parallel/Serial :
Serial
Datasheets
XC17S100ASO20C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S100ASO20C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17S100A, Package / Case:20-SOIC (0.295, 7.50mm Width), Number of Terminations:20, Mounting Type:Surface Mount, Number of Pins:20, Operating Temperature:0°C~70°C, XC17S100ASO20C pinout, XC17S100ASO20C datasheet PDF, XC17S100ASO20C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S100ASO20C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S100ASO20C


[Configuration Proms for FPGAs AMD Xilinx XC17S100ASO20C] Overview

Introducing the cutting-edge XC17S100ASO20C by AMD Xilinx, a pioneering integrated circuit designed to revolutionize the field of programmable logic. This innovative IC PROM SER 100000 CTEMP 20SOIC boasts unparalleled capabilities in storing configuration data for Field-Programmable Gate Arrays (FPGAs), ensuring optimal performance and flexibility in a wide array of applications.

Engineered with precision and expertise, the XC17S100ASO20C offers exceptional reliability and efficiency, making it the preferred choice for professionals and businesses seeking top-tier electronic components. Its advanced features and robust construction make it an indispensable asset in the realm of electronic design and development.

XC17S100ASO20C Features

  • High-capacity storage: With a storage capacity of 100,000 bits, the XC17S100ASO20C provides ample space for storing intricate configuration data, ensuring seamless operation of FPGA devices.
  • Temperature tolerance: Designed to withstand extreme temperatures, this IC operates flawlessly across a wide temperature range, making it suitable for diverse environmental conditions.
  • Compact form factor: Housed in a 20SOIC package, the XC17S100ASO20C offers a compact and space-efficient solution for integration into various electronic systems and devices.
  • Low power consumption: Optimized for energy efficiency, this IC minimizes power consumption without compromising on performance, thereby enhancing overall system efficiency.
  • High reliability: Built to meet stringent quality standards, the XC17S100ASO20C ensures reliable operation and long-term durability, reducing maintenance requirements and enhancing product longevity.

XC17S100ASO20C Applications

  • Programmable logic controllers (PLCs): The XC17S100ASO20C is ideally suited for use in PLCs, where it facilitates the configuration and customization of logic functions, enabling precise control and automation in industrial applications.
  • Embedded systems: Leveraging its high-capacity storage and temperature tolerance, this IC is widely deployed in embedded systems, such as automotive electronics and consumer appliances, to enable efficient data processing and control.
  • Communication infrastructure: In telecommunications and networking equipment, the XC17S100ASO20C plays a vital role in configuring FPGA-based components, ensuring seamless connectivity and data transmission in complex networks.
  • Avionics and aerospace: With its robust construction and reliability, this IC is trusted for mission-critical applications in avionics and aerospace systems, where it contributes to the efficient operation of navigation, communication, and control systems.
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