XC17S100APD8I
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- Mfr.Part #
- XC17S100APD8I
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 100000 I-TEMP 8-DIP
- Stock
- 28,191
- In Stock ：
- 28,191
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Length :
- 9.3599mm
- Packaging :
- Tube
- Density :
- 1 Mb
- Published :
- 1999
- Number of Terminations :
- 8
- Terminal Position :
- Dual
- Number of Functions :
- 1
- Supply Current-Max :
- 0.015mA
- Number of Pins :
- 8
- Height Seated (Max) :
- 4.5974mm
- RoHS Status :
- Non-RoHS Compliant
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- ECCN Code :
- EAR99
- Programmable Type :
- OTP
- Peak Reflow Temperature (Cel) :
- 225
- Lead Free :
- Contains Lead
- Pin Count :
- 8
- Surface Mount :
- No
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- JESD-609 Code :
- e0
- Standby Current-Max :
- 0.001A
- Operating Supply Voltage :
- 3.3V
- Parallel/Serial :
- Serial
- I/O Type :
- COMMON
- Radiation Hardening :
- No
- Voltage - Supply :
- 3V~3.6V
- Supply Voltage-Min (Vsup) :
- 3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Output Characteristics :
- 3-STATE
- Width :
- 7.62mm
- Supply Voltage :
- 3.3V
- Memory IC Type :
- CONFIGURATION MEMORY
- Memory Width :
- 1
- Mounting Type :
- Through Hole
- Terminal Pitch :
- 2.54mm
- Operating Temperature :
- -40°C~85°C
- Base Part Number :
- XC17S100A
- Datasheets
- XC17S100APD8I
[Configuration Proms for FPGAs - AMD Xilinx XC17S100APD8I] Overview
Introducing the cutting-edge XC17S100APD8I, meticulously crafted by AMD Xilinx, a pinnacle of excellence in the realm of integrated circuits. This IC PROM SER 100000 ITEMP 8DIP stands as a testament to relentless innovation and unwavering quality standards. Designed to meet the dynamic demands of modern electronic systems, this device embodies reliability, efficiency, and versatility.
Equipped with state-of-the-art technology, the XC17S100APD8I serves as a cornerstone for seamless integration within FPGA configurations, ensuring optimal performance and scalability. Its compact 8DIP package conceals a powerhouse of functionality, offering unparalleled flexibility in diverse applications.
Engineered with precision and backed by AMD Xilinx's legacy of excellence, the XC17S100APD8I redefines possibilities, empowering businesses to thrive in a rapidly evolving technological landscape.
XC17S100APD8I Features
- Advanced IC PROM SER technology
- Highly reliable 100,000 iteration capability
- Compact 8DIP package for easy integration
- Efficient and versatile configuration support for FPGAs
- Robust performance in varying environmental conditions
- Backed by AMD Xilinx's renowned quality assurance
XC17S100APD8I Applications
- Embedded Systems: Seamlessly integrates into embedded systems architecture, providing reliable configuration support for FPGA-based solutions. Ideal for IoT devices, industrial automation, and consumer electronics.
- Telecommunication Infrastructure: Enhances the performance and scalability of telecommunication networks, enabling efficient data processing and transmission. Deployed in base stations, routers, and network switches.
- Automotive Electronics: Ensures the stability and functionality of automotive electronic control units (ECUs), enabling advanced features such as driver assistance systems, infotainment, and vehicle networking.
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