XC17512LPD8I

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Mfr.Part #
XC17512LPD8I
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER I-TEMP 512K 8-DIP
Stock
21,544
In Stock :
21,544

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Terminal Position :
Dual
Qualification Status :
Not Qualified
Organization :
512KX1
Number of Functions :
1
Memory IC Type :
CONFIGURATION MEMORY
Base Part Number :
XC17512L
Reach Compliance Code :
not_compliant
Supply Voltage-Max (Vsup) :
3.6V
Operating Mode :
SYNCHRONOUS
Packaging :
Tube
ECCN Code :
EAR99
JESD-609 Code :
e0
Mounting Type :
Through Hole
Voltage - Supply :
3V~3.6V
Length :
9.3599mm
Standby Current-Max :
0.00005A
Package / Case :
8-DIP (0.300, 7.62mm)
Programmable Type :
OTP
Supply Voltage :
3.3V
Parallel/Serial :
Serial
Height Seated (Max) :
4.5974mm
Width :
7.62mm
Moisture Sensitivity Level (MSL) :
Not Applicable
Lead Free :
Contains Lead
Power Supplies :
3.3V
Terminal Pitch :
2.54mm
Published :
2000
Memory Width :
1
RoHS Status :
Non-RoHS Compliant
Number of Pins :
8
Clock Frequency :
15MHz
I/O Type :
COMMON
Operating Temperature :
-40°C~85°C
Additional Feature :
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Surface Mount :
No
Pbfree Code :
No
Supply Voltage-Min (Vsup) :
3V
Number of Terminations :
8
Pin Count :
8
Memory Size :
512kB
Output Characteristics :
3-STATE
Peak Reflow Temperature (Cel) :
225
Time@Peak Reflow Temperature-Max (s) :
30
Supply Current-Max :
0.005mA
Datasheets
XC17512LPD8I
Introducing Configuration Proms for FPGAs AMD Xilinx XC17512LPD8I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC17512L, Mounting Type:Through Hole, Package / Case:8-DIP (0.300, 7.62mm), Number of Pins:8, Operating Temperature:-40°C~85°C, Number of Terminations:8, XC17512LPD8I pinout, XC17512LPD8I datasheet PDF, XC17512LPD8I amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17512LPD8I ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17512LPD8I


[Configuration Proms for FPGAs] Overview

Welcome to the forefront of digital integration with AMD Xilinx's XC17512LPD8I. This cutting-edge Integrated Circuit Programmable Read-Only Memory (PROM) stands as a testament to the relentless pursuit of innovation in the realm of electronic components. Specifically designed to cater to the dynamic needs of modern electronic systems, this IC PROM serves as a pivotal component in configuring Field-Programmable Gate Arrays (FPGAs), ensuring seamless functionality and optimal performance.

With a capacity of 512K and packaged in a space-efficient 8DIP format, the XC17512LPD8I encapsulates a wealth of capabilities within its compact design. Whether you're delving into complex FPGA configurations or embarking on ambitious digital projects, this PROM promises reliability, efficiency, and versatility, making it the ideal choice for discerning professionals seeking to push the boundaries of electronic engineering.

XC17512LPD8I Features

  • 512K capacity: Ample storage space to accommodate intricate FPGA configurations and data.
  • 8DIP package: Compact form factor for seamless integration into electronic systems, optimizing space utilization.
  • Programmable Read-Only Memory: Facilitates easy configuration of FPGAs, enabling rapid prototyping and system development.
  • High reliability: Built to withstand demanding operating conditions, ensuring consistent performance over extended periods.
  • Efficient power consumption: Enhances energy efficiency, contributing to overall system sustainability and longevity.

XC17512LPD8I Applications

  • Embedded Systems: Utilized in embedded applications such as industrial control systems, automotive electronics, and medical devices, where reliable FPGA configuration is essential for seamless operation.
  • This PROM plays a crucial role in configuring FPGAs within embedded systems, ensuring precise control and seamless integration with various sensors, actuators, and communication interfaces.

  • Telecommunications Infrastructure: Deployed in telecommunications infrastructure equipment, including routers, switches, and base stations, to facilitate dynamic reconfiguration and optimization of network resources.
  • By leveraging the XC17512LPD8I, telecommunications providers can swiftly adapt to evolving network demands, enhancing flexibility, scalability, and performance.

  • Data Center Solutions: Integrated into data center infrastructure for rapid provisioning and customization of hardware resources, enabling efficient virtualization and workload management.
  • This PROM empowers data center operators to optimize resource utilization, streamline deployment processes, and meet the evolving demands of modern cloud computing environments.

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Shipping Cost

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