XC17512LPD8I
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- Mfr.Part #
- XC17512LPD8I
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER I-TEMP 512K 8-DIP
- Stock
- 21,544
- In Stock ：
- 21,544
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Position :
- Dual
- I/O Type :
- COMMON
- Pbfree Code :
- No
- Lead Free :
- Contains Lead
- Terminal Pitch :
- 2.54mm
- Voltage - Supply :
- 3V~3.6V
- Mounting Type :
- Through Hole
- Supply Current-Max :
- 0.005mA
- Supply Voltage-Min (Vsup) :
- 3V
- Memory IC Type :
- CONFIGURATION MEMORY
- Base Part Number :
- XC17512L
- Memory Size :
- 512kB
- Clock Frequency :
- 15MHz
- Reach Compliance Code :
- not_compliant
- Peak Reflow Temperature (Cel) :
- 225
- JESD-609 Code :
- e0
- Standby Current-Max :
- 0.00005A
- Power Supplies :
- 3.3V
- Qualification Status :
- Not Qualified
- Parallel/Serial :
- Serial
- Additional Feature :
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- Surface Mount :
- No
- Width :
- 7.62mm
- Pin Count :
- 8
- Number of Terminations :
- 8
- Output Characteristics :
- 3-STATE
- Length :
- 9.3599mm
- Organization :
- 512KX1
- Supply Voltage :
- 3.3V
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Memory Width :
- 1
- Packaging :
- Tube
- ECCN Code :
- EAR99
- Operating Temperature :
- -40°C~85°C
- Height Seated (Max) :
- 4.5974mm
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Published :
- 2000
- Number of Pins :
- 8
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Type :
- OTP
- Number of Functions :
- 1
- Operating Mode :
- SYNCHRONOUS
- Datasheets
- XC17512LPD8I
[Configuration Proms for FPGAs] Overview
Welcome to the forefront of digital integration with AMD Xilinx's XC17512LPD8I. This cutting-edge Integrated Circuit Programmable Read-Only Memory (PROM) stands as a testament to the relentless pursuit of innovation in the realm of electronic components. Specifically designed to cater to the dynamic needs of modern electronic systems, this IC PROM serves as a pivotal component in configuring Field-Programmable Gate Arrays (FPGAs), ensuring seamless functionality and optimal performance.
With a capacity of 512K and packaged in a space-efficient 8DIP format, the XC17512LPD8I encapsulates a wealth of capabilities within its compact design. Whether you're delving into complex FPGA configurations or embarking on ambitious digital projects, this PROM promises reliability, efficiency, and versatility, making it the ideal choice for discerning professionals seeking to push the boundaries of electronic engineering.
XC17512LPD8I Features
- 512K capacity: Ample storage space to accommodate intricate FPGA configurations and data.
- 8DIP package: Compact form factor for seamless integration into electronic systems, optimizing space utilization.
- Programmable Read-Only Memory: Facilitates easy configuration of FPGAs, enabling rapid prototyping and system development.
- High reliability: Built to withstand demanding operating conditions, ensuring consistent performance over extended periods.
- Efficient power consumption: Enhances energy efficiency, contributing to overall system sustainability and longevity.
XC17512LPD8I Applications
- Embedded Systems: Utilized in embedded applications such as industrial control systems, automotive electronics, and medical devices, where reliable FPGA configuration is essential for seamless operation.
- Telecommunications Infrastructure: Deployed in telecommunications infrastructure equipment, including routers, switches, and base stations, to facilitate dynamic reconfiguration and optimization of network resources.
- Data Center Solutions: Integrated into data center infrastructure for rapid provisioning and customization of hardware resources, enabling efficient virtualization and workload management.
This PROM plays a crucial role in configuring FPGAs within embedded systems, ensuring precise control and seamless integration with various sensors, actuators, and communication interfaces.
By leveraging the XC17512LPD8I, telecommunications providers can swiftly adapt to evolving network demands, enhancing flexibility, scalability, and performance.
This PROM empowers data center operators to optimize resource utilization, streamline deployment processes, and meet the evolving demands of modern cloud computing environments.
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