XA6SLX9-2FTG256Q

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Mfr.Part #
XA6SLX9-2FTG256Q
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 186 I/O 256FTBGA
Stock
483
In Stock :
483

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Number of Outputs :
186
Package / Case :
256-LBGA
Speed Grade :
2
RoHS Status :
ROHS3 Compliant
Number of Registers :
11440
Number of LABs/CLBs :
715
Number of I/O :
186
Base Part Number :
XA6SLX9
Factory Lead Time :
11 Weeks
Terminal Pitch :
1mm
Packaging :
Tray
Operating Temperature :
-40°C~125°C TJ
Number of Pins :
256
Mount :
Surface Mount
RAM Size :
72kB
Number of Logic Elements/Cells :
9152
Mounting Type :
Surface Mount
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Qualification Status :
Not Qualified
Operating Supply Voltage :
1.2V
Series :
Automotive, AEC-Q100, Spartan®-6 LX XA
Voltage - Supply :
1.14V~1.26V
Number of Terminations :
256
Published :
2008
Total RAM Bits :
589824
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
JESD-609 Code :
e1
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Datasheets
XA6SLX9-2FTG256Q
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2FTG256Q from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:XA6SLX9, Operating Temperature:-40°C~125°C TJ, Number of Pins:256, Mounting Type:Surface Mount, Number of Terminations:256, XA6SLX9-2FTG256Q pinout, XA6SLX9-2FTG256Q datasheet PDF, XA6SLX9-2FTG256Q amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2FTG256Q ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA6SLX9-2FTG256Q


FPGAs AMD Xilinx XA6SLX9-2FTG256Q Overview

The FPGAs AMD Xilinx XA6SLX9-2FTG256Q is an advanced field programmable gate array (FPGA) designed for robust digital processing and versatile applications. Manufactured by AMD Xilinx, a leader in digital design technologies, this IC features 186 I/O pins and is packaged in a compact 256FTBGA format, making it ideal for high-density, space-constrained environments. This FPGA enables designers to achieve high levels of system integration while reducing power consumption and overall cost. It is especially suitable for applications requiring rapid prototyping and extensive re-programmability, providing a critical competitive edge in fast-evolving markets.

XA6SLX9-2FTG256Q Features

The XA6SLX9-2FTG256Q FPGA is equipped with multiple notable features including a high I/O count, a dense 256 ball grid array packaging, and support for various logic configuration options. Its flexibility in programming and reconfiguration makes it highly effective for complex digital computations and signal processing tasks. The device's architecture is optimized for efficient power management and superior performance scalability, making it an ideal choice for both high-volume production and bespoke application deployments.

XA6SLX9-2FTG256Q Applications

  • Consumer Electronics: Utilized in smart home devices and entertainment systems to provide flexible control and connectivity solutions.
  • Telecommunications: Employs its high I/O capabilities for signal processing and data flow management in networking equipment such as routers and switches.
  • Automotive Systems: Integrated into automotive electronics for advanced driver-assistance systems (ADAS) to enhance vehicle safety and performance.
  • Industrial Automation: Supports robust automation solutions in manufacturing environments, increasing operational efficiency and reliability.
  • Medical Devices: Forms the core processing unit within medical diagnostic equipment, enabling complex real-time data analysis and patient monitoring.
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