XA6SLX100-2FGG484I

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Mfr.Part #
XA6SLX100-2FGG484I
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 326 I/O 484FBGA
Stock
32,590
In Stock :
32,590

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
ECCN Code :
3A991.D
Voltage - Supply :
1.14V~1.26V
Number of Outputs :
326
Mount :
Surface Mount
RAM Size :
603kB
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
484
Terminal Form :
Ball
Series :
Automotive, AEC-Q100, Spartan®-6 LX XA
Operating Supply Voltage :
1.2V
JESD-609 Code :
e1
Factory Lead Time :
10 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
Terminal Finish :
TIN SILVER COPPER
Base Part Number :
XA6SLX100
Number of LABs/CLBs :
7911
Total RAM Bits :
4939776
Published :
2008
Number of Logic Elements/Cells :
101261
Packaging :
Tray
Number of Pins :
484
Clock Frequency :
667MHz
Number of Registers :
126576
Speed Grade :
2
Peak Reflow Temperature (Cel) :
250
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
326
Qualification Status :
Not Qualified
Package / Case :
484-BBGA
Operating Temperature :
-40°C~100°C TJ
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX100-2FGG484I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:484, Base Part Number:XA6SLX100, Number of Pins:484, Mounting Type:Surface Mount, Package / Case:484-BBGA, Operating Temperature:-40°C~100°C TJ, XA6SLX100-2FGG484I pinout, XA6SLX100-2FGG484I datasheet PDF, XA6SLX100-2FGG484I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX100-2FGG484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA6SLX100-2FGG484I


FPGAs AMD Xilinx XA6SLX100-2FGG484I Overview

The FPGAs AMD Xilinx XA6SLX100-2FGG484I is a highly capable field-programmable gate array designed to meet the rigorous demands of modern digital circuits. This IC, housed in a 484FBGA package, boasts an impressive array of 326 I/Os, offering versatile connectivity options for a variety of electronic applications. With its robust design and advanced technology, the XA6SLX100-2FGG484I is engineered to provide a scalable, high-performance solution for complex digital systems. Its adaptability and efficiency make it an ideal choice for developers and engineers looking to push the boundaries of technology in industrial, commercial, and high-tech environments.

XA6SLX100-2FGG484I Features

This FPGA from AMD Xilinx features a dense array of programmable logic cells, making it highly suitable for high-speed data processing and intricate algorithm implementations. The 484-pin fine-pitch ball grid array (FBGA) package ensures compactness and a reduced footprint on system boards, facilitating more efficient use of space in tight designs. Additionally, the device's compatibility with multiple I/O standards allows for seamless integration into existing designs, reducing development time and cost.

XA6SLX100-2FGG484I Applications

  • Telecommunications: Utilized in routing and switching solutions, the XA6SLX100-2FGG484I can handle complex signal processing tasks, enhancing data flow and network reliability.
  • Automotive: Integral in driver assistance systems, this FPGA processes real-time sensor data, supporting safety-critical applications such as automated braking and video-based monitoring systems.
  • Consumer Electronics: Employs its high I/O count in multi-function devices such as smart TVs and gaming consoles, enabling rich user interfaces and high-performance graphics processing.
  • Industrial Automation: In control systems, it performs reliable and precise control operations, managing machinery and process flows in factories.
  • Medical Devices: Used in imaging systems like ultrasound and MRI, the FPGA supports complex digital imaging algorithms, ensuring clear and precise diagnostics.
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