XA6SLX9-2CSG324Q

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Mfr.Part #
XA6SLX9-2CSG324Q
Manufacturer
AMD Xilinx
Package / Case
324-LFBGA, CSPBGA
Datasheet
Download
Description
IC FPGA 200 I/O 324CSBGA
Stock
5,960
In Stock :
5,960

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Number of LABs/CLBs :
715
Number of Logic Elements/Cells :
9152
Number of Pins :
324
Total RAM Bits :
589824
Number of Registers :
11440
Terminal Position :
BOTTOM
Package / Case :
324-LFBGA, CSPBGA
Peak Reflow Temperature (Cel) :
260
Mount :
Surface Mount
JESD-609 Code :
e1
Operating Temperature :
-40°C~125°C TJ
Terminal Pitch :
0.8mm
Terminal Form :
Ball
Factory Lead Time :
10 Weeks
Number of I/O :
200
Qualification Status :
Not Qualified
RoHS Status :
ROHS3 Compliant
Operating Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade :
2
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Voltage - Supply :
1.14V~1.26V
Series :
Automotive, AEC-Q100, Spartan®-6 LX XA
Published :
2008
Number of Outputs :
200
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
72kB
Number of Terminations :
324
ECCN Code :
3A991.D
Base Part Number :
XA6SLX9
Datasheets
XA6SLX9-2CSG324Q
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2CSG324Q from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:324, Package / Case:324-LFBGA, CSPBGA, Operating Temperature:-40°C~125°C TJ, Number of Terminations:324, Base Part Number:XA6SLX9, XA6SLX9-2CSG324Q pinout, XA6SLX9-2CSG324Q datasheet PDF, XA6SLX9-2CSG324Q amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA6SLX9-2CSG324Q ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA6SLX9-2CSG324Q


FPGAs AMD Xilinx XA6SLX9-2CSG324Q Overview

The FPGAs AMD Xilinx XA6SLX9-2CSG324Q is an advanced integrated circuit developed by AMD Xilinx, specifically designed for applications requiring high-performance, programmable logic solutions. This IC FPGA features 200 I/O options housed in a 324CSBGA package, offering flexibility and scalability for complex digital systems. Its robust design enables efficient power management and high-speed digital processing, making it ideal for deploying in technology-intensive environments. The XA6SLX9-2CSG324Q is engineered to cater to the needs of developers looking for customizable, yet powerful FPGA solutions to drive innovation and performance in their applications.

XA6SLX9-2CSG324Q Features

  • High I/O Count: Equipped with 200 input/output ports, allowing for extensive peripheral and modular interfacing.
  • Compact Form Factor: Utilizes a 324-pin count CSBGA (Chip Scale Ball Grid Array) package that optimizes space on the PCB without sacrificing performance.
  • Programmability: Allows for on-the-fly reconfiguration, supporting dynamic project updates and iterations.
  • Power Efficiency: Designed for low power consumption, which enhances the overall system energy management.

XA6SLX9-2CSG324Q Applications

  • Consumer Electronics: Integrated into devices such as smartphones and tablets to facilitate complex digital processing and connectivity enhancements.
  • Automotive Systems: Used in car entertainment and navigation systems, ensuring robust performance and adaptability to vehicle-specific technologies.
  • Industrial Automation: Powers machinery and control systems that require high reliability and programmability for various industrial tasks.
  • Telecommunications: Critical in the development of telecommunications infrastructure, such as base stations and network routers, to manage data traffic efficiently and securely.
  • Healthcare Equipment: Deployed in medical devices that require high-speed data processing and precision, such as imaging systems and diagnostic tools.
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