W971GG8KB-25

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Height Seated (Max) :

1.2mm

Supply Voltage-Max (Vsup) :

1.9V

I/O Type :

COMMON

Terminal Pitch :

0.8mm

Operating Temperature :

0°C~85°C TC

Number of Terminations :

60

Length :

12.5mm

Output Characteristics :

3-STATE

Power Supplies :

1.8V

Interleaved Burst Length :

48

Supply Voltage :

1.8V

Surface Mount :

yes

JESD-30 Code :

R-PBGA-B60

Organization :

128MX8

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

RoHS Status :

ROHS3 Compliant

ECCN Code :

EAR99

Operating Mode :

SYNCHRONOUS

Width :

8mm

Memory Format :

DRAM

Write Cycle Time - Word, Page :

15ns

Number of Ports :

1

Memory Width :

8

Packaging :

Tray

Refresh Cycles :

8192

Qualification Status :

Not Qualified

Memory Type :

Volatile

Pin Count :

60

Published :

2016

Memory Interface :

Parallel

Additional Feature :

AUTO/SELF REFRESH

Package / Case :

60-TFBGA

Terminal Position :

BOTTOM

Memory Density :

1073741824 bit

Memory Size :

1Gb 128M x 8

Sequential Burst Length :

48

HTS Code :

8542.32.00.32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Current-Max :

0.185mA

Clock Frequency :

200MHz

Number of Functions :

1

Voltage - Supply :

1.7V~1.9V

Access Time :

400ps

Supply Voltage-Min (Vsup) :

1.7V

Mounting Type :

Surface Mount