W632GG8KB-12
- Mfr.Part #
- W632GG8KB-12
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 78-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 2GBIT PARALLEL 78WBGA
- Stock
- 20,573
- In Stock :
- 20,573
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Output Characteristics :
- 3-STATE
- Supply Voltage :
- 1.5V
- Supply Voltage-Max (Vsup) :
- 1.575V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 78
- Voltage - Supply :
- 1.425V~1.575V
- Sequential Burst Length :
- 48
- Memory Size :
- 2Gb 256M x 8
- Memory Interface :
- Parallel
- Power Supplies :
- 1.5V
- Memory Density :
- 2147483648 bit
- Memory Type :
- Volatile
- Access Time :
- 20ns
- Package / Case :
- 78-TFBGA
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Supply Voltage-Min (Vsup) :
- 1.425V
- Number of Ports :
- 1
- Additional Feature :
- AUTO/SELF REFRESH
- I/O Type :
- COMMON
- Refresh Cycles :
- 8192
- Length :
- 10.5mm
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~95°C TC
- Qualification Status :
- Not Qualified
- Pin Count :
- 78
- Standby Current-Max :
- 0.019A
- Memory Width :
- 8
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Supply Current-Max :
- 0.34mA
- Clock Frequency :
- 800MHz
- Interleaved Burst Length :
- 48
- Height Seated (Max) :
- 1.2mm
- Published :
- 2016
- Memory Format :
- DRAM
- Number of Terminations :
- 78
- Operating Mode :
- SYNCHRONOUS
- Terminal Pitch :
- 0.8mm
- Organization :
- 256MX8
- Number of Functions :
- 1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- HTS Code :
- 8542.32.00.36
- Width :
- 8mm
- Surface Mount :
- yes
- Datasheets
- W632GG8KB-12

Memory Winbond Electronics Corporation W632GG8KB-12 Overview
The Memory Winbond Electronics Corporation W632GG8KB-12 is a high-capacity DRAM IC from Winbond Electronics Corporation, featuring a robust 2 Gbit parallel interface. Housed in a compact 78WBGA package, this memory chip offers excellent stability and performance for intensive applications requiring large amounts of data storage and quick access times. The use of advanced technology in the fabrication of this DRAM ensures that it meets the high standards required for reliability and efficiency in modern electronics. Its versatility and high density make it an ideal choice for manufacturers looking to integrate reliable memory solutions into their products.
W632GG8KB-12 Features
This DRAM IC is designed for high-performance applications, providing a substantial 2 Gbit storage capacity which is essential for handling large datasets and complex operations. The parallel interface ensures efficient data handling, improving system responsiveness and operational efficiency. The compact 78WBGA package is engineered for space-constrained applications, making it perfect for modern electronic devices where space is at a premium but performance cannot be compromised.
W632GG8KB-12 Applications
- Consumer Electronics: The W632GG8KB-12 is used in devices such as smartphones, tablets, and gaming consoles where large memory capacity and quick access times are crucial for user experience.
- Computing Devices: Ideal for use in laptops, desktops, and servers, this DRAM helps manage multiple tasks and large volumes of data efficiently, ensuring smooth system performance.
- Automotive Systems: In automotive electronics, the W632GG8KB-12 supports advanced navigation and infotainment systems requiring high-speed data processing and robust memory capabilities.
- Industrial Applications: Suitable for industrial automation systems, this memory chip handles complex algorithms and processes in machinery control units.
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