W632GG6KB-15
- Mfr.Part #
- W632GG6KB-15
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 96-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 2GBIT PARALLEL 96WBGA
- Stock
- 8,516
- In Stock :
- 8,516
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Published :
- 2016
- Sequential Burst Length :
- 8
- Qualification Status :
- Not Qualified
- Memory Width :
- 16
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Refresh Cycles :
- 8192
- ECCN Code :
- EAR99
- Factory Lead Time :
- 14 Weeks
- Terminal Position :
- BOTTOM
- Address Bus Width :
- 17b
- Density :
- 2 GB
- Supply Voltage-Max (Vsup) :
- 1.575V
- Packaging :
- Tray
- Organization :
- 128MX16
- Memory Type :
- Volatile
- Clock Frequency :
- 667MHz
- Additional Feature :
- AUTO/SELF REFRESH
- Pin Count :
- 96
- Mount :
- Surface Mount
- Access Time :
- 20ns
- Voltage - Supply :
- 1.425V~1.575V
- Number of Ports :
- 1
- Memory Format :
- DRAM
- Supply Voltage :
- 1.5V
- HTS Code :
- 8542.32.00.36
- Height Seated (Max) :
- 1.2mm
- I/O Type :
- COMMON
- Operating Temperature :
- 0°C~95°C TC
- Operating Mode :
- SYNCHRONOUS
- Terminal Pitch :
- 0.8mm
- Output Characteristics :
- 3-STATE
- Interleaved Burst Length :
- 8
- Package / Case :
- 96-TFBGA
- Memory Size :
- 2Gb 128M x 16
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 96
- Number of Pins :
- 96
- Mounting Type :
- Surface Mount
- Memory Interface :
- Parallel
- Standby Current-Max :
- 0.065A
- Nominal Supply Current :
- 235mA
- Supply Voltage-Min (Vsup) :
- 1.425V
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1.5V
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 13mm
- Datasheets
- W632GG6KB-15

Memory Winbond Electronics Corporation W632GG6KB-15 Overview
The W632GG6KB-15 from Winbond Electronics Corporation stands out in the Memory category as a robust 2Gbit DRAM designed for high-efficiency and high-speed data processing. Built using Winbond's advanced fabrication techniques, this IC ensures reliability and performance for demanding applications. The DRAM module is packaged in a compact 96-ball WBGAr form factor, making it ideal for space-constrained applications while providing a significant bandwidth and storage capacity, vital for both consumer and industrial grade applications. Its low power consumption and high-speed data transfer capabilities make it an excellent choice for developers looking to enhance system performance with reliable, high-capacity memory.
W632GG6KB-15 Features
The W632GG6KB-15 features a 2Gbit capacity with a parallel interface for high-speed data access. Its 96WBGA packaging is optimized for compact designs, enhancing thermal stability and reducing physical footprint in assembled devices. This DRAM module supports a wide range of operating temperatures, making it suitable for rigorous environments, and offers stability and robustness for intensive operations, proving essential in high-performance settings.
W632GG6KB-15 Applications
- Smartphones and Tablets: Provides the necessary high-speed, high-capacity memory required for multitasking and running advanced operating systems and applications seamlessly.
- Personal Computers: Enhances system responsiveness and allows for efficient handling of large-scale software applications and data-intensive processes.
- Embedded Systems: Ideal for use in automation, where consistent and reliable memory performance is crucial for control processes and real-time data management.
- Gaming Consoles: Contributes to smooth, fast-loading, and detailed gaming experiences by accommodating large game files and high-speed game data processing.
- Server Farms: Critical in managing vast amounts of data efficiently, ensuring quick access and storage reliability in server environments.
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