W631GG6MB11I
- Mfr.Part #
- W631GG6MB11I
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 96-VFBGA
- Datasheet
- Download
- Description
- IC DRAM 1GBIT PARALLEL 96VFBGA
- Stock
- 3,621
- In Stock :
- 3,621
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Operating Temperature :
- -40°C~95°C TC
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 1mm
- Supply Voltage-Min (Vsup) :
- 1.425V
- Packaging :
- Tray
- Voltage - Supply :
- 1.425V~1.575V
- Supply Voltage-Max (Vsup) :
- 1.575V
- Memory Width :
- 16
- Memory Size :
- 1Gb 64M x 16
- Access Time :
- 20ns
- Package / Case :
- 96-VFBGA
- Memory Density :
- 1073741824 bit
- Operating Mode :
- SYNCHRONOUS
- Number of Functions :
- 1
- Clock Frequency :
- 933MHz
- Width :
- 7.5mm
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.5V
- Organization :
- 64MX16
- Memory Type :
- Volatile
- Additional Feature :
- AUTO/SELF REFRESH
- Surface Mount :
- yes
- Published :
- 2017
- Number of Terminations :
- 96
- Terminal Pitch :
- 0.8mm
- Number of Ports :
- 1
- Terminal Position :
- BOTTOM
- Length :
- 13mm
- Memory Format :
- DRAM
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- R-PBGA-B96
- Datasheets
- W631GG6MB11I

Memory Winbond Electronics Corporation W631GG6MB11I Overview
The Winbond Electronics Corporation W631GG6MB11I is a high-performance 1Gbit DRAM integrated circuit, engineered specifically for applications requiring large-scale, high-speed data processing and storage. This memory module utilizes a parallel interface with a 96VFBGA packaging, ensuring compact integration and reliable connectivity in a variety of computing environments. Its robust architecture and high data throughput capabilities make it an ideal choice for manufacturers looking to enhance the performance of their advanced digital devices. This overview highlights the Memory Winbond Electronics Corporation W631GG6MB11I's strategic importance for B2B customers seeking volume procurement opportunities for high-quality, efficient memory solutions.
W631GG6MB11I Features
This IC DRAM from Winbond features a dense 1Gbit capacity, providing substantial space for high-volume applications. The parallel interface facilitates faster data transfer rates, which is critical for high-performance computing tasks. The compact 96VFBGA package allows for efficient space utilization in complex PCB designs, making it highly suitable for streamlined modern electronics.
W631GG6MB11I Applications
- Advanced Computing Systems: Utilized in server farms and data centers to manage large databases and perform complex computations, enhancing overall system efficiency.
- Consumer Electronics: Integral in devices such as high-definition televisions and gaming consoles, where large amounts of data are processed to deliver enhanced user experiences.
- Telecommunication Infrastructure: Deployed in telecommunications equipment to handle high-speed data transfers and support robust communication protocols.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, improving safety and performance.
- Industrial Automation: Facilitates improved control and operational efficiency in automated manufacturing systems through fast, reliable data processing.
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