W631GG6KB11I
- Mfr.Part #
- W631GG6KB11I
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 96-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 1GBIT PARALLEL 96WBGA
- Stock
- 36,031
- In Stock :
- 36,031
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Supply Voltage-Min (Vsup) :
- 1.425V
- Packaging :
- Tray
- Terminal Pitch :
- 0.8mm
- Width :
- 9mm
- Memory Density :
- 1073741824 bit
- Operating Mode :
- SYNCHRONOUS
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Size :
- 1Gb 64M x 16
- Memory Interface :
- Parallel
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Memory Width :
- 16
- Additional Feature :
- AUTO/SELF REFRESH
- Memory Type :
- Volatile
- Supply Voltage :
- 1.5V
- RoHS Status :
- ROHS3 Compliant
- JESD-30 Code :
- R-PBGA-B96
- Access Time :
- 20ns
- ECCN Code :
- EAR99
- Clock Frequency :
- 933MHz
- Number of Functions :
- 1
- Voltage - Supply :
- 1.425V~1.575V
- Package / Case :
- 96-TFBGA
- Memory Format :
- DRAM
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 96
- Number of Ports :
- 1
- Length :
- 13mm
- Terminal Position :
- BOTTOM
- Organization :
- 64MX16
- Operating Temperature :
- -40°C~95°C TC
- Supply Voltage-Max (Vsup) :
- 1.575V
- Height Seated (Max) :
- 1.2mm
- Datasheets
- W631GG6KB11I

Memory Winbond Electronics Corporation W631GG6KB11I Overview
The Winbond Electronics Corporation W631GG6KB11I is a cutting-edge memory solution that stands out in the market for its robust capabilities and reliability. This 1Gbit DRAM chip is designed with a parallel interface and packaged in a compact 96-ball WBG array, making it an ideal choice for applications requiring high-density and high-speed data processing. The use of advanced fabrication technology ensures this memory module delivers enhanced performance and lower power consumption, tailored for B2B clients seeking volume deployment in various high-demand environments.
W631GG6KB11I Features
The W631GG6KB11I DRAM from Winbond offers several key features that make it highly attractive for industrial applications. These include high data integrity, low latency, and a stable temperature operation range. Its high-speed data transfer capabilities and reduced power draw contribute significantly to system efficiency, making it a versatile component in any high-performance computing system.
W631GG6KB11I Applications
- Consumer Electronics: Used in devices such as smartphones and tablets to manage multiple applications simultaneously without compromising performance.
- Automotive Systems: Integrates into advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors efficiently.
- Industrial Automation: Employs in automation controls and machinery to handle complex computations and enhance operational reliability.
- Networking Equipment: Supports high-speed network switches and routers, facilitating rapid data flow and reducing latency.
- Gaming Consoles: Provides the necessary speed and capacity for next-gen gaming consoles, ensuring smooth gameplay and quick load times.
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Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















