W29N08GVBIAA

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Length :

11 mm

Maximum Erase Time (S) :

0.01/Block

Operating Current (mA) :

35

Package Width :

9

Minimum Endurance (Cycles) :

100000

Width :

9 mm

Memory Interface :

Parallel

Programming Voltage (V) :

2.7 to 3.6

Timing Type :

ASYNCHRONOUS

EU RoHS :

Compliant

Memory Type :

Non-Volatile

HTS :

8542.32.00.71

Memory Density :

8GB

Boot Block :

No

Speed :

40MHz

Minimum Operating Temperature (°C) :

-40

Number of Bits/Word (bit) :

8

ECC Support :

yes

Package / Case :

63-VFBGA

Organization :

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

Package Shape :

RECTANGULAR

Operating Temperature :

-40°C ~ 85°C (TA)

Surface Mount :

yes

Support of Page Mode :

yes

Terminal Pitch :

0.8 mm

Supplier Device Package :

63-VFBGA (9x11)

Sector Size :

128Kbyte x 8192

Typical Operating Supply Voltage (V) :

3|3.3

Interface Type :

Parallel

Memory Size :

8Gbit

Product Status :

Active

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Base Product Number :

W29N08

Automotive :

yes

Command Compatible :

No

Reach Compliance Code :

Compliant

Clock Frequency :

40 MHz

Maximum Operating Supply Voltage (V) :

3.6

Technology :

FLASH - NAND (SLC)

Temperature Grade :

Industrial

Manufacturer :

Winbond Electronics Corp

Seated Height-Max :

1 mm

JESD-30 Code :

R-PBGA-B63

Series :

-

Mounting :

Surface Mount

Supply Voltage-Min (Vsup) :

2.7 V

Chip Density (bit) :

8G

ECCN (US) :

3A991.B.1.A

Supply Voltage-Max (Vsup) :

3.6 V

Programming Voltage :

3 V

Memory Organization :

1G x 8

Maximum Programming Time (ms) :

0.7/Page

Type :

SLC NAND Flash

Minimum Operating Supply Voltage (V) :

2.7

Access Time :

25 ns

Address Bus Width (bit) :

31

Number of Functions :

1

Write Cycle Time - Word, Page :

25ns

Programmability :

yes

Memory Width :

8

Supplier Package :

VFBGA

Memory Format :

Flash

Package :

Tray

Program Current (mA) :

35

Voltage - Supply :

2.7V ~ 3.6V

Package Length :

11

Package Height :

0.6(Max)

Page Size :

2Kbyte

Block Organization :

Symmetrical

PCB changed :

63

Cell Type :

SLC NAND

Standard Package Name :

BGA

Supplier Temperature Grade :

Industrial

Lead Shape :

Ball

Memory IC Type :

Flash

Number of Terminals :

63

Parallel/Serial :

Parallel

Number of Words :

1G

PPAP :

Unknown

Architecture :

Sectored

Terminal Form :

Ball

Temperature :

-40ºC ~ 85ºC / -40ºC ~ 105ºC

Mounting Type :

Surface Mount

Pin Count :

63

Terminal Position :

BOTTOM

Maximum Operating Temperature (°C) :

85

Operating Mode :

ASYNCHRONOUS