W29N01HVBINF TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

ECCN (US) :

3A991.B.1.A

Supplier Package :

VFBGA

Interface Type :

Parallel

Programmability :

yes

Minimum Operating Temperature (°C) :

-40

Package Height :

0.6(Max)

Minimum Operating Supply Voltage (V) :

2.7

Pin Count :

63

Chip Density (bit) :

1G

Maximum Operating Frequency (MHz) :

40

Mounting :

Surface Mount

Supplier Temperature Grade :

Industrial

Minimum Endurance (Cycles) :

100000

Maximum Operating Supply Voltage (V) :

3.6

Support of Page Mode :

yes

Program Current (mA) :

35

Maximum Erase Time (S) :

0.01/Block

Sector Size :

128Kbyte x 1024

Architecture :

Sectored

Page Size :

2Kbyte

Number of Bits/Word (bit) :

8

EU RoHS :

Compliant

ECC Support :

yes

Package Length :

11

PPAP :

No

Package Width :

9

Operating Current (mA) :

35

Automotive :

No

Command Compatible :

No

Maximum Operating Temperature (°C) :

85

Boot Block :

No

Maximum Programming Time (ms) :

0.7/Page

Timing Type :

ASYNCHRONOUS

Cell Type :

SLC NAND

Number of Words :

128M

Typical Operating Supply Voltage (V) :

3|3.3

Address Bus Width (bit) :

28

Block Organization :

Symmetrical

PCB changed :

63