W29N01HVSINF TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Supplier Package :

TSOP-I

Cell Type :

SLC NAND

Programmability :

yes

Lead Shape :

Gull-wing

Maximum Operating Temperature (°C) :

85

Chip Density (bit) :

1G

Architecture :

Sectored

Number of Words :

128M

Interface Type :

Parallel

Sector Size :

128Kbyte x 1024

ECC Support :

yes

Maximum Programming Time (ms) :

0.7/Page

Minimum Operating Temperature (°C) :

-40

PPAP :

No

Typical Operating Supply Voltage (V) :

3.3|3

Maximum Operating Supply Voltage (V) :

3.6

Command Compatible :

No

Number of Bits/Word (bit) :

8

Address Bus Width (bit) :

28

EU RoHS :

Compliant

Package Length :

12

Page Size :

2Kbyte

Package Height :

1

Programming Voltage (V) :

2.7 to 3.6

Maximum Erase Time (S) :

0.01/Block

Automotive :

No

ECCN (US) :

3A991.B.1.A

Standard Package Name :

SOP

Supplier Temperature Grade :

Industrial

PCB changed :

48

Timing Type :

ASYNCHRONOUS

Support of Page Mode :

yes

Minimum Endurance (Cycles) :

100000

Operating Current (mA) :

35

Maximum Operating Frequency (MHz) :

40

Boot Block :

No

Program Current (mA) :

35

Package Width :

18.4

Mounting :

Surface Mount

Block Organization :

Symmetrical

Pin Count :

48

Minimum Operating Supply Voltage (V) :

2.7