W29N01HVSINA TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Package Width :

18.4

Cell Type :

SLC NAND

Chip Density (bit) :

1G

Maximum Erase Time (S) :

0.01/Block

PPAP :

No

Typical Operating Supply Voltage (V) :

3|3.3

Sector Size :

128Kbyte x 1024

Programmability :

yes

Page Size :

2Kbyte

Pin Count :

48

Architecture :

Sectored

Maximum Operating Frequency (MHz) :

40

Interface Type :

Parallel

EU RoHS :

Compliant

Number of Bits/Word (bit) :

8

Minimum Endurance (Cycles) :

100000

Package Length :

12

Minimum Operating Temperature (°C) :

-40

Standard Package Name :

SOP

Lead Shape :

Gull-wing

Block Organization :

Symmetrical

Command Compatible :

No

Support of Page Mode :

yes

ECC Support :

yes

Minimum Operating Supply Voltage (V) :

2.7

Mounting :

Surface Mount

ECCN (US) :

3A991.B.1.A

Operating Current (mA) :

35

Maximum Programming Time (ms) :

0.7/Page

Automotive :

No

Package Height :

1

Supplier Temperature Grade :

Industrial

Supplier Package :

TSOP-I

Timing Type :

ASYNCHRONOUS

Program Current (mA) :

35

Number of Words :

128M

Address Bus Width (bit) :

28

PCB changed :

48

Boot Block :

No

Maximum Operating Supply Voltage (V) :

3.6

Programming Voltage (V) :

2.7 to 3.6

Maximum Operating Temperature (°C) :

85