W29GL512SH9B

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Mfr.Part #
W29GL512SH9B
Manufacturer
Winbond Electronics Corporation
Package / Case
64-LBGA
Datasheet
Download
Description
IC FLSH 512MBIT PARALLEL 64LFBGA
Stock
26,446
In Stock :
26,446

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Manufacturer :
Winbond Electronics Corporation
Product Category :
Memory
Min Operating Temperature :
-40°C
Max Operating Temperature :
85°C
Mounting Type :
Surface Mount
Write Cycle Time - Word, Page :
90ns
Packaging :
Tray
Package / Case :
64-LBGA
Memory Type :
Non-Volatile
Voltage - Supply :
2.7V~3.6V
RoHS Status :
ROHS3 Compliant
Published :
2016
Supplier Device Package :
64-LFBGA (11x13)
Memory Interface :
Parallel
Access Time :
90ns
Memory Format :
Flash
Operating Temperature :
-40°C~85°C TA
Number of Pins :
64
Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
512Mb 32M x 16
Datasheets
W29GL512SH9B
Introducing Memory Winbond Electronics Corporation W29GL512SH9B from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:64-LBGA, Operating Temperature:-40°C~85°C TA, Number of Pins:64, W29GL512SH9B pinout, W29GL512SH9B datasheet PDF, W29GL512SH9B amp .Beyond Memory Winbond Electronics Corporation W29GL512SH9B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Winbond Electronics Corporation W29GL512SH9B


Memory Winbond Electronics Corporation W29GL512SH9B Overview

The Memory Winbond Electronics Corporation W29GL512SH9B is a high

Memory Winbond Electronics Corporation W29GL512SH9B Overview

Introducing the W29GL512SH9B from Winbond Electronics Corporation, a cutting-edge memory solution that bridges robust capacity and advanced technical specifications in one efficient package. Specifically designedacity for, applications parallel requiring interface flash memory device that high-speed, combines performance, reliable reliability, data storage and retrieval and, this cost-effectiveness IC. FLASH Engineered integrates by Win512bondM Electronics Corporationbit of memory, a leader in semiconductor solutions capacity within a compact, this IC flash64 memoryL offers a substantial 512FBGA Mbit storage capacity in a compact package. As 64LFBGA package. Designed a Memory to Winbond Electronics meet the rigorous Corporation W29GL512SH9B product, it ensures optimal performance demands of high and durability for industrial-performance-grade projects embedded systems,, the making W it29GL512 an excellentSH9B ensures efficient data management and retention, making it an ideal choice for manufacturers looking to incorporate large memory capacities into their designs without compromising on space choice or for manufacturers power seeking consumption. system

andW29 performanceGL. B Features> The29 W29GLGL512512SHSH99BB flash memory Features features a parallel

The speeds W and29 easy integration into system architectures. ItsGL 512SH9B512 M boastsbit a capacity allows wide for array substantial data of storage features in a suited small for form factor demanding, storage and applications the .64 KeyLFB characteristicsGA include package a ensures minimized parallel space interface usage on for PCB quicks data. This access and IC high throughput, a substantial 512Mbit storage is capacity, and a small form-factor 64 alsoLFBGA package characterized that by minimizes its space usage low power while consumption maximizing functionality. This flash, which is critical for portable memory and is power designed-sensitive for applications high. reliability With and its robust endurance design,, the ensuring W consistent29GL performance512 acrossSH9 varyingB operational guarantees long conditions-term reliability. range operational conditionsW. GLW299GLB512 ApplicationsSH9 2> >

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