W25P16VSSIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Length :

5.27mm

Data Retention Time-Min :

20

Number of Pins :

8

Power Supplies :

3/3.3V

Organization :

16MX1

Peak Reflow Temperature (Cel) :

260

Endurance :

100000 Write/Erase Cycles

Number of Terminations :

8

ECCN Code :

EAR99

Lead Free :

Lead Free

Access Time :

50 µs

Memory Size :

16Mb 2M x 8

Operating Temperature :

-40°C~85°C TA

Programming Voltage :

2.7V

Supply Voltage :

3V

Package / Case :

8-SOIC (0.209, 5.30mm Width)

Terminal Position :

Dual

Supply Current-Max :

0.032mA

Address Bus Width :

1b

Memory Format :

Flash

Packaging :

Tube

Height Seated (Max) :

2.16mm

Terminal Finish :

MATTE TIN

Memory Type :

Non-Volatile

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Radiation Hardening :

No

Memory Interface :

SPI

Surface Mount :

yes

Memory Width :

1

Pin Count :

8

Number of Functions :

1

Time@Peak Reflow Temperature-Max (s) :

40

Series :

SpiFlash®

Terminal Pitch :

1.27mm

JESD-609 Code :

e3

Write Protection :

HARDWARE/SOFTWARE

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage-Min (Vsup) :

2.7V

Serial Bus Type :

SPI

Voltage - Supply :

2.7V~3.6V

RoHS Status :

ROHS3 Compliant

Interface :

SPI, Serial

Density :

16 Mb

Write Cycle Time - Word, Page :

7ms

Standby Current-Max :

0.000005A

Clock Frequency :

50MHz

Published :

2006