TSW-108-23-G-T
- Mfr.Part #
- TSW-108-23-G-T
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 24POS 2.54MM
- Stock
- 416
- In Stock :
- 416
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Number Of PCB Rows :
- 3
- Lead Pitch :
- 2.54mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Connector Type :
- Header
- REACH SVHC :
- No SVHC
- Contact Length - Mating :
- 0.230 5.84mm
- Fastening Type :
- Push-Pull
- Radiation Hardening :
- No
- Insulation Material :
- Polybutylene Terephthalate (PBT)
- Overall Contact Length :
- 0.445 11.30mm
- Number of Conductors :
- ONE
- Pbfree Code :
- yes
- Filter Feature :
- No
- Length - Termination :
- 0.115 inch
- Mounting Type :
- Through Hole
- Insulation Color :
- Black
- Mixed Contacts :
- No
- Contact Type :
- Male Pin
- RoHS Status :
- ROHS3 Compliant
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Number of Positions Loaded :
- All
- Contact Material :
- Phosphor Bronze
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- PCB Contact Pattern :
- RECTANGULAR
- Contact Shape :
- Square
- Gender :
- Male
- PCB Contact Row Spacing :
- 5.08 mm
- MIL Conformance :
- No
- Published :
- 2005
- Body Depth :
- 0.1 inch
- Contact Length - Post :
- 0.115 2.92mm
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Number of Positions :
- 24
- Series :
- TSW
- Reliability :
- COMMERCIAL
- JESD-609 Code :
- e4
- Termination :
- Solder
- Option :
- GENERAL PURPOSE
- IEC Conformance :
- No
- Factory Lead Time :
- 3 Weeks
- Pitch - Mating :
- 0.100 2.54mm
- Packaging :
- Bulk
- Body Breadth :
- 0.1 inch
- Insulation Height :
- 0.100 2.54mm
- Reference Standard :
- UL
- Mating Contact Pitch :
- 0.1 inch
- Style :
- Board to Board or Cable
- Number of Rows :
- 3
- Operating Temperature :
- -55°C~125°C
- DIN Conformance :
- No
- Mount :
- Through Hole
- Plating Thickness :
- 10μin
- Shrouding :
- Unshrouded
- Contact Finish - Mating :
- Gold
- Material Flammability Rating :
- UL94 V-0
- Datasheets
- TSW-108-23-G-T
TSW Series 3-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Polybutylene Terephthalate (PBT) 24-Position Board to Board or Cable 0.100 2.54mm Height
TSW-108-23-G-T Overview
Packaging for this item is Header.There is a mounting type of Through Hole for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the TSW Series.Through Hole is used to mount the part.In this case, the device operates at -55°C~125°C Operating Temperature.
TSW-108-23-G-T Features
TSW series
TSW-108-23-G-T Applications
There are a lot of Samtec Inc.
TSW-108-23-G-T Rectangular Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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