TSS-135-01-G-D
- Mfr.Part #
- TSS-135-01-G-D
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 70POS 2.54MM
- Stock
- 6,353
- In Stock :
- 6,353
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Packaging :
- Tube
- Operating Temperature :
- -55°C~125°C
- Shrouding :
- Shrouded - 4 Wall
- Insulation Color :
- Black
- Material Flammability Rating :
- UL94 V-0
- Contact Type :
- Male Pin
- Contact Shape :
- Square
- Fastening Type :
- Push-Pull
- Contact Material :
- Phosphor Bronze
- Series :
- Flex Stack, TSS
- Number of Positions Loaded :
- All
- Contact Length - Mating :
- 0.250 6.35mm
- Insulation Height :
- 0.350 8.89mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Factory Lead Time :
- 3 Weeks
- Number of Positions :
- 70
- Insulation Material :
- Polybutylene Terephthalate (PBT)
- Feature :
- Keying Slot
- Connector Type :
- Header
- Pitch - Mating :
- 0.100 2.54mm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Style :
- Board to Board or Cable
- Termination :
- Solder
- Overall Contact Length :
- 0.480 12.19mm
- Mounting Type :
- Through Hole
- RoHS Status :
- ROHS3 Compliant
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Contact Length - Post :
- 0.115 2.92mm
- Number of Rows :
- 2
- Contact Finish - Mating :
- Gold
- Datasheets
- TSS-135-01-G-D
Flex Stack, TSS Series 2-Row Header Solder Phosphor Bronze Tube Through Hole Gold Polybutylene Terephthalate (PBT) 70-Position Board to Board or Cable 0.350 8.89mm Height
TSS-135-01-G-D Overview
It comes in Header packaging.The device's mounting type is Through Hole.In order to package the product, a Tube case is used.It belongs to the Flex Stack, TSS Series of products.Its Keying Slot feature renders it more powerful in many ways.The device runs in -55°C~125°C Operating Temperature.
TSS-135-01-G-D Features
Flex Stack, TSS series
TSS-135-01-G-D Applications
There are a lot of Samtec Inc.
TSS-135-01-G-D Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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