TSM-130-02-S-DV-LC
- Mfr.Part #
- TSM-130-02-S-DV-LC
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 60POS 2.54MM
- Stock
- 15,928
- In Stock :
- 15,928
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Number Of PCB Rows :
- 2
- Max Voltage Rating (AC) :
- 475V
- Connector Type :
- Header
- Mating Contact Pitch :
- 0.1 inch
- RoHS Status :
- ROHS3 Compliant
- Number of Rows :
- 2
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Pitch - Mating :
- 0.100 2.54mm
- Contact Finish - Post :
- Tin
- Total Number of Contacts :
- 60
- Contact Finish - Mating :
- Gold
- Factory Lead Time :
- 3 Weeks
- Termination :
- Solder
- Depth :
- 5.08mm
- Reliability :
- COMMERCIAL
- Contact Material :
- Phosphor Bronze
- Filter Feature :
- No
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Number of Positions Loaded :
- All
- Number of Conductors :
- ONE
- Packaging :
- Tube
- Gender :
- Male
- Insulation Color :
- Black
- Contact Type :
- Male Pin
- Number of Positions :
- 60
- Feature :
- Board Lock
- MIL Conformance :
- No
- JESD-609 Code :
- e3
- Contact Shape :
- Square
- Contact Length - Mating :
- 0.320 8.13mm
- Style :
- Board to Board or Cable
- Pbfree Code :
- yes
- Plating Thickness :
- 30μin
- Operating Temperature :
- -55°C~125°C
- Insulation Height :
- 0.100 2.54mm
- Length :
- 76.2mm
- Additional Feature :
- E.L.P.
- IEC Conformance :
- No
- Mounting Type :
- Surface Mount
- Housing Material :
- Polymer
- Option :
- GENERAL PURPOSE
- Material Flammability Rating :
- UL94 V-0
- PCB Contact Row Spacing :
- 4.953 mm
- Shrouding :
- Unshrouded
- Orientation :
- Straight
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Lead Free :
- Lead Free
- DIN Conformance :
- No
- Mixed Contacts :
- No
- Fastening Type :
- Push-Pull
- PCB Contact Pattern :
- RECTANGULAR
- Series :
- TSM
- Datasheets
- TSM-130-02-S-DV-LC

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 60-Position Board to Board or Cable 0.100 2.54mm Height
TSM-130-02-S-DV-LC Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Lock feature.There is no operating temperature for the device.
TSM-130-02-S-DV-LC Features
TSM series
TSM-130-02-S-DV-LC Applications
There are a lot of Samtec Inc.
TSM-130-02-S-DV-LC Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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