TSM-130-01-S-DV-A-P
- Mfr.Part #
- TSM-130-01-S-DV-A-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 60POS 2.54MM
- Stock
- 4,077
- In Stock :
- 4,077
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Operating Temperature :
- -55°C~125°C
- Fastening Type :
- Push-Pull
- Filter Feature :
- No
- Connector Type :
- Header
- Number of Conductors :
- ONE
- PCB Contact Pattern :
- RECTANGULAR
- Contact Shape :
- Square
- MIL Conformance :
- No
- Option :
- GENERAL PURPOSE
- RoHS Status :
- ROHS3 Compliant
- Insulation Color :
- Black
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Contact Material :
- Phosphor Bronze
- Factory Lead Time :
- 3 Weeks
- Number of Positions Loaded :
- All
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tube
- Number of Rows :
- 2
- Number Of PCB Rows :
- 2
- Contact Finish - Mating :
- Gold
- Material Flammability Rating :
- UL94 V-0
- Termination :
- Solder
- Additional Feature :
- E.L.P.
- Reliability :
- COMMERCIAL
- Series :
- TSM
- Mixed Contacts :
- No
- Pbfree Code :
- yes
- IEC Conformance :
- No
- Plating Thickness :
- 30μin
- Style :
- Board to Board or Cable
- Contact Type :
- Male Pin
- PCB Contact Row Spacing :
- 4.953 mm
- Total Number of Contacts :
- 60
- Gender :
- Male
- Feature :
- Board Guide, Pick and Place
- Board Mounting Option :
- PEG
- Body Length or Diameter :
- 3 inch
- Insulation Height :
- 0.100 2.54mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Mounting Type :
- Surface Mount
- Pitch - Mating :
- 0.100 2.54mm
- JESD-609 Code :
- e3
- Body Depth :
- 0.15 inch
- Contact Length - Mating :
- 0.230 5.84mm
- Shrouding :
- Unshrouded
- Number of Positions :
- 60
- Lead Free :
- Lead Free
- Contact Finish - Post :
- Tin
- Mating Contact Pitch :
- 0.1 inch
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- DIN Conformance :
- No
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Datasheets
- TSM-130-01-S-DV-A-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 60-Position Board to Board or Cable 0.100 2.54mm Height
TSM-130-01-S-DV-A-P Overview
The product is packaged in Header.This device is mounted in the Surface Mount position.It has been determined that a Tube case is necessary to package the product.There is a product in the TSM Series.To name a few, there is also E.L.P..There are a number of advantages to its Board Guide, Pick and Place feature.As a result, the device runs at -55°C~125°C Operating Temperature.
TSM-130-01-S-DV-A-P Features
TSM series
TSM-130-01-S-DV-A-P Applications
There are a lot of Samtec Inc.
TSM-130-01-S-DV-A-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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