TSM-126-01-L-DV-A-P-TR
- Mfr.Part #
- TSM-126-01-L-DV-A-P-TR
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 52POS 2.54MM
- Stock
- 47,259
- In Stock :
- 47,259
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Type :
- Male Pin
- Style :
- Board to Board or Cable
- Feature :
- Board Guide, Pick and Place
- Contact Finish - Post :
- Tin
- Number of Rows :
- 2
- Insulation Color :
- Black
- Contact Material :
- Phosphor Bronze
- Series :
- TSM
- Contact Finish - Mating :
- Gold
- Number of Positions Loaded :
- All
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Contact Length - Mating :
- 0.230 5.84mm
- Material Flammability Rating :
- UL94 V-0
- Factory Lead Time :
- 3 Weeks
- Number of Positions :
- 52
- Lead Free :
- Lead Free
- Shrouding :
- Unshrouded
- Fastening Type :
- Push-Pull
- Contact Shape :
- Square
- Termination :
- Solder
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tape and Reel (TR)
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Mounting Type :
- Surface Mount
- Pitch - Mating :
- 0.100 2.54mm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Connector Type :
- Header
- Insulation Height :
- 0.100 2.54mm
- Operating Temperature :
- -55°C~125°C
- Datasheets
- TSM-126-01-L-DV-A-P-TR

TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 52-Position Board to Board or Cable 0.100 2.54mm Height
TSM-126-01-L-DV-A-P-TR Overview
Packaging for this item is Header.There is a mounting type of Surface Mount for this device.It is necessary to use a Tape & Reel (TR) case for packaging the product.This product is part of the TSM Series.In many ways, its Board Guide, Pick and Place feature makes it more powerful.In this case, the device operates at -55°C~125°C Operating Temperature.
TSM-126-01-L-DV-A-P-TR Features
TSM series
TSM-126-01-L-DV-A-P-TR Applications
There are a lot of Samtec Inc.
TSM-126-01-L-DV-A-P-TR Rectangular Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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