TSM-116-05-T-DV
- Mfr.Part #
- TSM-116-05-T-DV
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 32POS 2.54MM
- Stock
- 44,686
- In Stock :
- 44,686
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Mating Contact Pitch :
- 0.1 inch
- Dielectric Withstanding Voltage :
- 1000VAC V
- PCB Contact Row Spacing :
- 5.4864 mm
- Number of Positions Loaded :
- All
- IEC Conformance :
- No
- JESD-609 Code :
- e3
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Shrouding :
- Unshrouded
- Connector Type :
- Header
- DIN Conformance :
- No
- Mixed Contacts :
- No
- Style :
- Board to Board or Cable
- Factory Lead Time :
- 3 Weeks
- Body Depth :
- 0.1 inch
- Insulation Color :
- Black
- Number Of PCB Rows :
- 2
- Operating Temperature :
- -55°C~105°C
- Packaging :
- Tube
- RoHS Status :
- ROHS3 Compliant
- Pitch - Mating :
- 0.100 2.54mm
- Contact Material :
- Phosphor Bronze
- Number of Conductors :
- ONE
- Material Flammability Rating :
- UL94 V-0
- Reference Standard :
- UL
- Pbfree Code :
- yes
- Published :
- 2016
- UL Flammability Code :
- 94V-0
- Contact Type :
- Male Pin
- Filter Feature :
- No
- Total Number of Contacts :
- 32
- Fastening Type :
- Push-Pull
- Rated Current (Signal) :
- 3A
- Number of Positions :
- 32
- Contact Finish - Mating :
- Tin
- Number of Rows :
- 2
- PCB Contact Pattern :
- RECTANGULAR
- Mounting Type :
- Surface Mount
- Contact Length - Mating :
- 0.075 1.90mm
- Contact Shape :
- Square
- ECCN Code :
- EAR99
- Reliability :
- COMMERCIAL
- Body Length or Diameter :
- 1.6 inch
- HTS Code :
- 8536.69.40.40
- Termination :
- Solder
- Insulation Height :
- 0.100 2.54mm
- MIL Conformance :
- No
- Option :
- GENERAL PURPOSE
- Insulation Resistance :
- 5000000000Ohm
- Series :
- TSM
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Datasheets
- TSM-116-05-T-DV

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 32-Position Board to Board or Cable 0.100 2.54mm Height
TSM-116-05-T-DV Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.There is no operating temperature for the device.
TSM-116-05-T-DV Features
TSM series
TSM-116-05-T-DV Applications
There are a lot of Samtec Inc.
TSM-116-05-T-DV Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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