TSM-116-02-L-SH-LC
- Mfr.Part #
- TSM-116-02-L-SH-LC
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD R/A 16POS 2.54MM
- Stock
- 14,885
- In Stock :
- 14,885
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Packaging :
- Tube
- Termination :
- Solder
- Contact Material :
- Phosphor Bronze
- Material Flammability Rating :
- UL94 V-0
- Additional Feature :
- E.L.P.
- Shrouding :
- Unshrouded
- Pbfree Code :
- yes
- RoHS Status :
- ROHS3 Compliant
- Number of Positions :
- 16
- Mixed Contacts :
- No
- Style :
- Board to Board or Cable
- Filter Feature :
- No
- Insulation Color :
- Black
- IEC Conformance :
- No
- Series :
- TSM
- DIN Conformance :
- No
- Contact Finish - Mating :
- Gold
- Feature :
- Board Lock
- Factory Lead Time :
- 3 Weeks
- Terminal Pitch :
- 2.54mm
- Contact Type :
- Male Pin
- Fastening Type :
- Push-Pull
- JESD-609 Code :
- e3
- Insulation Height :
- 0.120 3.05mm
- Reliability :
- COMMERCIAL
- MIL Conformance :
- No
- Number Of PCB Rows :
- 1
- PCB Contact Pattern :
- RECTANGULAR
- Number of Rows :
- 1
- Gender :
- Male
- Operating Temperature :
- -55°C~125°C
- Pitch - Mating :
- 0.100 2.54mm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Mounting Type :
- Surface Mount, Right Angle
- Lead Free :
- Lead Free
- Option :
- GENERAL PURPOSE
- Contact Length - Mating :
- 0.320 8.13mm
- Total Number of Contacts :
- 16
- Number of Positions Loaded :
- All
- Body Depth :
- 0.29 inch
- Contact Shape :
- Square
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Contact Finish - Post :
- Tin
- Number of Conductors :
- ONE
- Connector Type :
- Header
- Radiation Hardening :
- No
- Datasheets
- TSM-116-02-L-SH-LC

TSM Series 1-Row Header Solder Phosphor Bronze Tube Surface Mount, Right Angle Gold Liquid Crystal Polymer (LCP) 16-Position Board to Board or Cable 0.120 3.05mm Height
TSM-116-02-L-SH-LC Overview
It comes in Header packaging.The device's mounting type is Surface Mount, Right Angle.In order to package the product, a Tube case is used.It belongs to the TSM Series of products.In addition, there are other features such as E.L.P., to mention only a few.Its Board Lock feature renders it more powerful in many ways.The device runs in -55°C~125°C Operating Temperature.
TSM-116-02-L-SH-LC Features
TSM series
TSM-116-02-L-SH-LC Applications
There are a lot of Samtec Inc.
TSM-116-02-L-SH-LC Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















