TSM-116-01-T-DV-P-TR
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- Mfr.Part #
- TSM-116-01-T-DV-P-TR
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 32POS 2.54MM
- Stock
- 150
- In Stock ：
- 150
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- JESD-609 Code :
- e3
- Mounting Type :
- Surface Mount
- Insulation Height :
- 0.100 2.54mm
- Number Of PCB Rows :
- 2
- Packaging :
- Tape and Reel (TR)
- Contact Finish - Mating :
- Tin
- Contact Length - Mating :
- 0.230 5.84mm
- Pbfree Code :
- yes
- IEC Conformance :
- No
- Option :
- GENERAL PURPOSE
- Operating Temperature :
- -55°C~105°C
- Body Depth :
- 0.15 inch
- Mating Contact Pitch :
- 0.1 inch
- Body Length or Diameter :
- 1.6 inch
- Number of Positions Loaded :
- All
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Insulation Color :
- Black
- Gender :
- Male
- Shrouding :
- Unshrouded
- REACH SVHC :
- No SVHC
- Contact Material :
- Phosphor Bronze
- Mount :
- Surface Mount
- Contact Type :
- Male Pin
- Connector Type :
- Header
- Fastening Type :
- Push-Pull
- PCB Contact Pattern :
- RECTANGULAR
- Material Flammability Rating :
- UL94 V-0
- Filter Feature :
- No
- Number of Positions :
- 32
- Feature :
- Pick and Place
- Number of Conductors :
- ONE
- Number of Rows :
- 2
- Termination :
- Solder
- Series :
- TSM
- Pitch - Mating :
- 0.100 2.54mm
- PCB Contact Row Spacing :
- 4.953 mm
- RoHS Status :
- ROHS3 Compliant
- Contact Shape :
- Square
- Lead Free :
- Lead Free
- Total Number of Contacts :
- 32
- Mixed Contacts :
- No
- Factory Lead Time :
- 1 Weeks
- Published :
- 2014
- DIN Conformance :
- No
- Style :
- Board to Board or Cable
- Reliability :
- COMMERCIAL
- MIL Conformance :
- No
- Datasheets
- TSM-116-01-T-DV-P-TR
TSM-116-01-T-DV-P-TR Documents
TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Tin Liquid Crystal Polymer (LCP) 32-Position Board to Board or Cable 0.100 2.54mm Height
TSM-116-01-T-DV-P-TR Overview
Packaging for this item is Header.There is a mounting type of Surface Mount for this device.It is necessary to use a Tape & Reel (TR) case for packaging the product.This product is part of the TSM Series.In many ways, its Pick and Place feature makes it more powerful.Surface Mount is used to mount the part.In this case, the device operates at -55°C~105°C Operating Temperature.
TSM-116-01-T-DV-P-TR Features
TSM series
TSM-116-01-T-DV-P-TR Applications
There are a lot of Samtec Inc.
TSM-116-01-T-DV-P-TR Rectangular Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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