TSM-113-03-S-DV-P
- Mfr.Part #
- TSM-113-03-S-DV-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 26POS 2.54MM
- Stock
- 25,959
- In Stock :
- 25,959
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Length - Mating :
- 0.420 10.67mm
- Dielectric Withstanding Voltage :
- 1000VAC V
- Pitch - Mating :
- 0.100 2.54mm
- Style :
- Board to Board or Cable
- Shrouding :
- Unshrouded
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Contact Type :
- Male Pin
- Contact Finish - Mating :
- Gold
- Plating Thickness :
- 30μin
- Insulation Resistance :
- 5000000000Ohm
- Lead Free :
- Lead Free
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Pbfree Code :
- yes
- Gender :
- Male
- Termination :
- Solder
- Contact Finish - Post :
- Tin
- Mixed Contacts :
- No
- Insulation Height :
- 0.100 2.54mm
- RoHS Status :
- ROHS3 Compliant
- PCB Contact Row Spacing :
- 5.4864 mm
- Packaging :
- Tube
- Reference Standard :
- UL
- Material Flammability Rating :
- UL94 V-0
- Series :
- TSM
- Contact Material :
- Phosphor Bronze
- PCB Contact Pattern :
- RECTANGULAR
- Mating Contact Pitch :
- 0.1 inch
- Additional Feature :
- E.L.P.
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Body Length or Diameter :
- 1.3 inch
- Number of Conductors :
- ONE
- Feature :
- Pick and Place
- Insulation Color :
- Black
- Option :
- GENERAL PURPOSE
- Operating Temperature :
- -55°C~125°C
- Number of Rows :
- 2
- Filter Feature :
- No
- JESD-609 Code :
- e3
- Contact Shape :
- Square
- Fastening Type :
- Push-Pull
- Factory Lead Time :
- 3 Weeks
- MIL Conformance :
- No
- Reliability :
- COMMERCIAL
- DIN Conformance :
- No
- IEC Conformance :
- No
- Number of Positions :
- 26
- Total Number of Contacts :
- 26
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Number of Positions Loaded :
- All
- Number Of PCB Rows :
- 2
- Mounting Type :
- Surface Mount
- HTS Code :
- 8536.69.40.40
- Connector Type :
- Header
- ECCN Code :
- EAR99
- Datasheets
- TSM-113-03-S-DV-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
TSM-113-03-S-DV-P Overview
Packaging is in the form of Header.This device has a Surface Mount mounting type.An orange Tube case is used to package the product.Specifically, it is one of the products in the TSM Series.Other features include E.L.P., to name just a few.Several benefits come from the Pick and Place feature.Devices operate at -55°C~125°C operating temperatures.
TSM-113-03-S-DV-P Features
TSM series
TSM-113-03-S-DV-P Applications
There are a lot of Samtec Inc.
TSM-113-03-S-DV-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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