TSM-113-03-S-DV-LC
- Mfr.Part #
- TSM-113-03-S-DV-LC
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 26POS 2.54MM
- Stock
- 2,052
- In Stock :
- 2,052
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- JESD-609 Code :
- e3
- Number of Conductors :
- ONE
- Contact Material :
- Phosphor Bronze
- Mixed Contacts :
- No
- IEC Conformance :
- No
- Series :
- TSM
- Number of Rows :
- 2
- Pbfree Code :
- yes
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Factory Lead Time :
- 3 Weeks
- Contact Finish - Post :
- Tin
- Pitch - Mating :
- 0.100 2.54mm
- Body Depth :
- 0.15 inch
- DIN Conformance :
- No
- Style :
- Board to Board or Cable
- Connector Type :
- Header
- Fastening Type :
- Push-Pull
- Packaging :
- Tube
- Total Number of Contacts :
- 26
- Contact Finish - Mating :
- Gold
- Contact Length - Mating :
- 0.420 10.67mm
- Reliability :
- COMMERCIAL
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Operating Temperature :
- -55°C~125°C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- PCB Contact Pattern :
- RECTANGULAR
- Termination :
- Solder
- Feature :
- Board Lock
- Number Of PCB Rows :
- 2
- Lead Free :
- Lead Free
- Mating Contact Pitch :
- 0.1 inch
- Contact Shape :
- Square
- Option :
- GENERAL PURPOSE
- Number of Positions :
- 26
- Material Flammability Rating :
- UL94 V-0
- Published :
- 2016
- Number of Positions Loaded :
- All
- Additional Feature :
- E.L.P.
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Insulation Color :
- Black
- RoHS Status :
- ROHS3 Compliant
- Shrouding :
- Unshrouded
- PCB Contact Row Spacing :
- 4.953 mm
- Plating Thickness :
- 30μin
- Body Length or Diameter :
- 1.3 inch
- Insulation Height :
- 0.100 2.54mm
- Filter Feature :
- No
- Mounting Type :
- Surface Mount
- MIL Conformance :
- No
- Contact Type :
- Male Pin
- Gender :
- Male
- Datasheets
- TSM-113-03-S-DV-LC

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
TSM-113-03-S-DV-LC Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Lock feature.There is no operating temperature for the device.
TSM-113-03-S-DV-LC Features
TSM series
TSM-113-03-S-DV-LC Applications
There are a lot of Samtec Inc.
TSM-113-03-S-DV-LC Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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