TSM-113-02-T-DV-LC
- Mfr.Part #
- TSM-113-02-T-DV-LC
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 26POS 2.54MM
- Stock
- 40,185
- In Stock :
- 40,185
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Fastening Type :
- Push-Pull
- JESD-609 Code :
- e3
- PCB Contact Row Spacing :
- 4.953 mm
- Shrouding :
- Unshrouded
- Feature :
- Board Lock
- Factory Lead Time :
- 3 Weeks
- Contact Type :
- Male Pin
- Lead Free :
- Lead Free
- Contact Finish - Mating :
- Tin
- IEC Conformance :
- No
- Total Number of Contacts :
- 26
- Filter Feature :
- No
- Style :
- Board to Board or Cable
- Mounting Type :
- Surface Mount
- Contact Material :
- Phosphor Bronze
- Body Length or Diameter :
- 1.3 inch
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Insulation Color :
- Black
- Contact Length - Mating :
- 0.320 8.13mm
- DIN Conformance :
- No
- Contact Shape :
- Square
- Published :
- 2016
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Number Of PCB Rows :
- 2
- PCB Contact Pattern :
- RECTANGULAR
- Number of Positions Loaded :
- All
- Reliability :
- COMMERCIAL
- Material Flammability Rating :
- UL94 V-0
- Mixed Contacts :
- No
- Pbfree Code :
- yes
- Mating Contact Pitch :
- 0.1 inch
- Option :
- GENERAL PURPOSE
- Packaging :
- Tube
- Termination :
- Solder
- Insulation Height :
- 0.100 2.54mm
- Number of Positions :
- 26
- Number of Conductors :
- ONE
- Gender :
- Male
- Operating Temperature :
- -55°C~105°C
- Series :
- TSM
- Pitch - Mating :
- 0.100 2.54mm
- Number of Rows :
- 2
- Body Depth :
- 0.15 inch
- Connector Type :
- Header
- Additional Feature :
- E.L.P.
- MIL Conformance :
- No
- RoHS Status :
- ROHS3 Compliant
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Datasheets
- TSM-113-02-T-DV-LC

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
TSM-113-02-T-DV-LC Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Board Lock feature.There is no operating temperature for the device.
TSM-113-02-T-DV-LC Features
TSM series
TSM-113-02-T-DV-LC Applications
There are a lot of Samtec Inc.
TSM-113-02-T-DV-LC Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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