TSM-113-02-L-DV-P

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Number Of PCB Rows :

2

Shrouding :

Unshrouded

Body Length or Diameter :

1.3 inch

JESD-609 Code :

e3

Row Spacing - Mating :

0.100 (2.54mm)

Number of Conductors :

ONE

Pbfree Code :

yes

RoHS Status :

ROHS3 Compliant

Insulation Height :

0.100 2.54mm

Contact Shape :

Square

Mixed Contacts :

No

Reliability :

COMMERCIAL

IEC Conformance :

No

Fastening Type :

Push-Pull

ECCN Code :

EAR99

MIL Conformance :

No

Filter Feature :

No

Operating Temperature :

-55°C~125°C

Total Number of Contacts :

26

Insulation Material :

Liquid Crystal Polymer (LCP)

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Insulation Color :

Black

Feature :

Pick and Place

Contact Material :

Phosphor Bronze

Contact Type :

Male Pin

Number of Rows :

2

Mounting Type :

Surface Mount

Material Flammability Rating :

UL94 V-0

Gender :

Male

Option :

GENERAL PURPOSE

Pitch - Mating :

0.100 2.54mm

Factory Lead Time :

3 Weeks

Style :

Board to Board or Cable

Connector Type :

Header

DIN Conformance :

No

PCB Contact Row Spacing :

5.4864 mm

Number of Positions Loaded :

All

Packaging :

Tube

Lead Free :

Lead Free

Mating Contact Pitch :

0.1 inch

Number of Positions :

26

HTS Code :

8536.69.40.40

Published :

2016

Contact Length - Mating :

0.320 8.13mm

Reference Standard :

UL

Contact Finish - Mating :

Gold

PCB Contact Pattern :

RECTANGULAR

Dielectric Withstanding Voltage :

1000VAC V

Insulation Resistance :

5000000000Ohm

Additional Feature :

POLARIZED

Contact Finish - Post :

Tin

Series :

TSM

Termination :

Solder

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Plating Thickness :

10μin