TSM-112-04-L-DV-P

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

IEC Conformance :

No

Contact Finish Thickness - Mating :

10.0μin 0.25μm

HTS Code :

8536.69.40.40

Reference Standard :

UL

ECCN Code :

EAR99

Option :

GENERAL PURPOSE

Termination :

Solder

Fastening Type :

Push-Pull

Plating Thickness :

10μin

Body Depth :

0.1 inch

Shrouding :

Unshrouded

RoHS Status :

ROHS3 Compliant

Reliability :

COMMERCIAL

Contact Material :

Phosphor Bronze

PCB Contact Pattern :

RECTANGULAR

Rated Current (Signal) :

3A

Contact Type :

Male Pin

Number of Rows :

2

Contact Length - Mating :

0.120 3.05mm

Number Of PCB Rows :

2

Number of Positions :

24

Insulation Height :

0.100 2.54mm

Style :

Board to Board or Cable

Mating Contact Pitch :

0.1 inch

Contact Finish - Post :

Tin

Packaging :

Tube

Row Spacing - Mating :

0.100 (2.54mm)

Factory Lead Time :

3 Weeks

Operating Temperature :

-55°C~125°C

DIN Conformance :

No

Insulation Resistance :

5000000000Ohm

Material Flammability Rating :

UL94 V-0

Mounting Type :

Surface Mount

Total Number of Contacts :

24

Pbfree Code :

yes

Connector Type :

Header

Filter Feature :

No

Contact Shape :

Square

MIL Conformance :

No

JESD-609 Code :

e3

Number of Positions Loaded :

All

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mixed Contacts :

No

Contact Finish - Mating :

Gold

Additional Feature :

E.L.P.

Number of Conductors :

ONE

Pitch - Mating :

0.100 2.54mm

Series :

TSM

Feature :

Pick and Place

Insulation Material :

Liquid Crystal Polymer (LCP)

Insulation Color :

Black

Dielectric Withstanding Voltage :

1000VAC V

PCB Contact Row Spacing :

5.4864 mm