TSM-111-03-T-DV-P-TR
- Mfr.Part #
- TSM-111-03-T-DV-P-TR
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 22POS 2.54MM
- Stock
- 14,617
- In Stock :
- 14,617
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Factory Lead Time :
- 3 Weeks
- Lead Free :
- Lead Free
- Contact Type :
- Male Pin
- Mounting Type :
- Surface Mount
- Insulation Height :
- 0.100 2.54mm
- Feature :
- Pick and Place
- Number of Positions :
- 22
- Number of Rows :
- 2
- Series :
- TSM
- Number of Positions Loaded :
- All
- Contact Shape :
- Square
- Operating Temperature :
- -55°C~105°C
- Fastening Type :
- Push-Pull
- Shrouding :
- Unshrouded
- Style :
- Board to Board or Cable
- Connector Type :
- Header
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Finish - Post :
- Tin
- Contact Finish - Mating :
- Tin
- RoHS Status :
- ROHS3 Compliant
- Contact Material :
- Phosphor Bronze
- Insulation Color :
- Black
- Pitch - Mating :
- 0.100 2.54mm
- Material Flammability Rating :
- UL94 V-0
- Termination :
- Solder
- Contact Length - Mating :
- 0.420 10.67mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Packaging :
- Tape and Reel (TR)
- Datasheets
- TSM-111-03-T-DV-P-TR

TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Tin Liquid Crystal Polymer (LCP) 22-Position Board to Board or Cable 0.100 2.54mm Height
TSM-111-03-T-DV-P-TR Overview
This product is packaged in a Header box.Surface Mount indicates that the device is mounted.An Tape & Reel (TR) case is utilized for packaging the product.The product is a part of the TSM Series.In many ways, Pick and Place makes it more powerful.Operating temperature is set to -55°C~105°C.
TSM-111-03-T-DV-P-TR Features
TSM series
TSM-111-03-T-DV-P-TR Applications
There are a lot of Samtec Inc.
TSM-111-03-T-DV-P-TR Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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