TSM-111-01-S-DV-P

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

JESD-609 Code :

e3

Contact Finish Thickness - Mating :

30.0μin 0.76μm

Insulation Resistance :

5000000000Ohm

Connector Type :

Header

Number Of PCB Rows :

2

IEC Conformance :

No

Style :

Board to Board or Cable

Reference Standard :

UL

Pitch - Mating :

0.100 2.54mm

HTS Code :

8536.69.40.40

Number of Positions Loaded :

All

Feature :

Pick and Place

RoHS Status :

ROHS3 Compliant

Insulation Height :

0.100 2.54mm

ECCN Code :

EAR99

Packaging :

Tube

Mounting Type :

Surface Mount

Total Number of Contacts :

22

Dielectric Withstanding Voltage :

1000VAC V

DIN Conformance :

No

Mixed Contacts :

No

PCB Contact Pattern :

RECTANGULAR

Row Spacing - Mating :

0.100 (2.54mm)

Number of Positions :

22

Shrouding :

Unshrouded

Number of Rows :

2

Series :

TSM

Insulation Color :

Black

Fastening Type :

Push-Pull

Contact Length - Mating :

0.230 5.84mm

Published :

2007

Contact Shape :

Square

Plating Thickness :

30μin

Contact Finish - Mating :

Gold

Lead Free :

Lead Free

Material Flammability Rating :

UL94 V-0

Insulation Material :

Liquid Crystal Polymer (LCP)

Reliability :

COMMERCIAL

Termination :

Solder

Body Length or Diameter :

1.1 inch

Number of Conductors :

ONE

Contact Finish - Post :

Tin

Contact Type :

Male Pin

MIL Conformance :

No

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Filter Feature :

No

PCB Contact Row Spacing :

5.4864 mm

Option :

GENERAL PURPOSE

Pbfree Code :

yes

Contact Material :

Phosphor Bronze

Factory Lead Time :

3 Weeks

Mating Contact Pitch :

0.1 inch

Radiation Hardening :

No

Gender :

Male

Operating Temperature :

-55°C~125°C