TMS32C6416DGLZ6E3

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Mfr.Part #
TMS32C6416DGLZ6E3
Manufacturer
Texas Instruments
Package / Case
532-BFBGA, FCBGA
Datasheet
Download
Description
IC DSP FIXED-POINT 532-BGA
Stock
1,684
In Stock :
1,684

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
On Chip Data RAM :
1.03MB
RoHS Status :
ROHS3 Compliant
JESD-609 Code :
e0
Number of Terminations :
532
Bit Size :
32
Frequency :
600MHz
Mount :
Surface Mount
Internal Bus Architecture :
Multiple
Mounting Type :
Surface Mount
Interface :
Host Interface, McBSP, PCI, UTOPIA
Pin Count :
532
Additional Feature :
ALSO REQUIRES 3.3VI/O SUPPLY
Address Bus Width :
32
Supply Voltage :
1.4V
Radiation Hardening :
No
External Data Bus Width :
64
Lead Free :
Contains Lead
Boundary Scan :
yes
RAM (words) :
16384
Supply Voltage-Max (Vsup) :
1.44V
Supply Voltage-Min (Vsup) :
1.36V
Base Part Number :
32C6416
Length :
23mm
Terminal Pitch :
0.8mm
Terminal Finish :
TIN LEAD
Barrel Shifter :
No
Peak Reflow Temperature (Cel) :
220
Power Supplies :
1.43.3V
Height Seated (Max) :
3.3mm
Voltage - Core :
1.40V
Non-Volatile Memory :
External
HTS Code :
8542.31.00.01
Voltage - I/O :
3.30V
Series :
TMS320C6414/15/16
Terminal Position :
BOTTOM
Number of Pins :
532
ECCN Code :
3A001.A.3
Package / Case :
532-BFBGA, FCBGA
Type :
FIXED POINT
Pbfree Code :
No
Terminal Form :
Ball
Operating Temperature :
0°C~90°C TC
Low Power Mode :
yes
Packaging :
Tray
Width :
23mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Datasheets
TMS32C6416DGLZ6E3
Introducing DSP (Digital Signal Processors) Texas Instruments TMS32C6416DGLZ6E3 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:532, Mounting Type:Surface Mount, Base Part Number:32C6416, Number of Pins:532, Package / Case:532-BFBGA, FCBGA, Type:FIXED POINT, Operating Temperature:0°C~90°C TC, TMS32C6416DGLZ6E3 pinout, TMS32C6416DGLZ6E3 datasheet PDF, TMS32C6416DGLZ6E3 amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMS32C6416DGLZ6E3 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMS32C6416DGLZ6E3


DSP Texas Instruments TMS32C6416DGLZ6E3 Overview

The DSP Texas Instruments TMS32C6416DGLZ6E3 is a highly sophisticated digital signal processor designed to meet the demanding needs of modern high-speed signal processing applications. This IC is built to offer exceptional performance in terms of speed and efficiency, featuring advanced technology that ensures reliable operation under a wide range of conditions. Its robust architecture allows for scalable solutions, making it ideal for both new designs and upgrades to existing systems. The device is housed in a 532-ball BGA package, optimized for thermal management and space-saving on circuit boards.

TMS32C6416DGLZ6E3 Features

This fixed-point DSP is equipped with a multitude of features that enhance its performance and usability in complex signal processing tasks. Key features include a high processing speed, large on-chip memory, and low-power consumption. These characteristics make it suitable for intensive computational tasks while maintaining efficiency. Additionally, its support for multiple interfaces allows for flexible integration into a variety of hardware configurations.

TMS32C6416DGLZ6E3 Applications

  • Telecommunications: Utilized in network infrastructure to manage signal integrity and processing, enhancing data transmission rates and reliability.
  • Audio Processing: Key component in audio systems for real-time signal processing, noise reduction, and sound quality enhancement.
  • Industrial Control Systems: Improves process control and monitoring in manufacturing environments through rapid signal processing capabilities.
  • Medical Imaging: Essential in the processing and analysis of complex medical images, helping to deliver clearer and more accurate diagnostic data.
  • Automotive Electronics: Used in systems for vehicle dynamics control and safety features, ensuring quicker response times and enhanced system reliability.
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