TMS32C6415DGLZ6E3
- Mfr.Part #
- TMS32C6415DGLZ6E3
- Manufacturer
- Texas Instruments
- Package / Case
- 532-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP FIXED-POINT 532-BGA
- Stock
- 622
- In Stock :
- 622
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Low Power Mode :
- yes
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Pins :
- 532
- Height Seated (Max) :
- 3.3mm
- RAM (words) :
- 16384
- Barrel Shifter :
- No
- Frequency :
- 600MHz
- Non-Volatile Memory :
- External
- HTS Code :
- 8542.31.00.01
- Address Bus Width :
- 23
- Interface :
- Host Interface, McBSP, PCI, UTOPIA
- ECCN Code :
- 3A001.A.3
- Voltage - Core :
- 1.40V
- Width :
- 23mm
- Peak Reflow Temperature (Cel) :
- 220
- Max Supply Voltage :
- 3.46V
- Lead Free :
- Lead Free
- On Chip Data RAM :
- 1.03MB
- Type :
- FIXED POINT
- Packaging :
- Tray
- Supply Voltage :
- 1.4V
- Number of Terminations :
- 532
- Base Part Number :
- 32C6415
- Terminal Finish :
- TIN LEAD
- Series :
- TMS320C6414/15/16
- Voltage - I/O :
- 3.30V
- Terminal Pitch :
- 0.8mm
- Operating Temperature :
- 0°C~90°C TC
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Internal Bus Architecture :
- Multiple
- Power Supplies :
- 1.43.3V
- Qualification Status :
- Not Qualified
- Length :
- 23mm
- Terminal Form :
- Ball
- Pin Count :
- 532
- Boundary Scan :
- yes
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Package / Case :
- 532-BFBGA, FCBGA
- Bit Size :
- 32
- Min Supply Voltage :
- 1.36V
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- External Data Bus Width :
- 64
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- TMS32C6415DGLZ6E3

DSP Texas Instruments TMS32C6415DGLZ6E3 Overview
The DSP Texas Instruments TMS32C6415DGLZ6E3 is a high-performance, fixed-point digital signal processor designed to meet the demanding requirements of multimedia and telecommunications applications. As an integral component from Texas Instruments, this IC excels in environments where efficient and rapid processing of digital signals is critical. The TMS32C6415DGLZ6E3 leverages advanced semiconductor technology, offering robust processing capabilities in a compact 532-ball BGA package. This product is tailored for developers looking for scalable solutions that ensure minimal power consumption and maximum reliability.
TMS32C6415DGLZ6E3 Features
This IC incorporates a range of features designed to optimize performance and facilitate system integration. Key attributes include high-speed data processing capabilities, enhanced memory architecture, and support for multiple interfaces. The TMS32C6415DGLZ6E3 offers an extensive set of peripherals, making it highly adaptable to new and evolving technological demands.
TMS32C6415DGLZ6E3 Applications
- Telecommunications: Used in equipment for data transmission and signal processing, enhancing both speed and reliability.
- Audio Processing: Integral in devices requiring high-quality sound processing, including synthesizers and audio mixing boards.
- Video Processing: Ideal for high-definition video streaming and editing platforms, where speed and clarity are paramount.
- Medical Imaging: Critical for the rapid and accurate processing required in modern medical imaging equipment, such as MRI and ultrasound machines.
- Industrial Automation: Employs advanced control systems to improve the efficiency and precision of automated manufacturing processes.
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