TMS32C6415DGLZ6E3
- Mfr.Part #
- TMS32C6415DGLZ6E3
- Manufacturer
- Texas Instruments
- Package / Case
- 532-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP FIXED-POINT 532-BGA
- Stock
- 622
- In Stock :
- 622
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-609 Code :
- e0
- Lead Free :
- Lead Free
- Terminal Position :
- BOTTOM
- Barrel Shifter :
- No
- Bit Size :
- 32
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- On Chip Data RAM :
- 1.03MB
- Power Supplies :
- 1.43.3V
- Peak Reflow Temperature (Cel) :
- 220
- RAM (words) :
- 16384
- ECCN Code :
- 3A001.A.3
- Internal Bus Architecture :
- Multiple
- Package / Case :
- 532-BFBGA, FCBGA
- Terminal Pitch :
- 0.8mm
- Width :
- 23mm
- Min Supply Voltage :
- 1.36V
- Terminal Form :
- Ball
- Series :
- TMS320C6414/15/16
- Voltage - I/O :
- 3.30V
- Operating Temperature :
- 0°C~90°C TC
- Frequency :
- 600MHz
- Number of Terminations :
- 532
- Supply Voltage :
- 1.4V
- Max Supply Voltage :
- 3.46V
- Interface :
- Host Interface, McBSP, PCI, UTOPIA
- Pin Count :
- 532
- Base Part Number :
- 32C6415
- Type :
- FIXED POINT
- Terminal Finish :
- TIN LEAD
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.31.00.01
- Low Power Mode :
- yes
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Non-Volatile Memory :
- External
- Boundary Scan :
- yes
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 3.3mm
- External Data Bus Width :
- 64
- Voltage - Core :
- 1.40V
- Qualification Status :
- Not Qualified
- Length :
- 23mm
- Address Bus Width :
- 23
- Packaging :
- Tray
- Number of Pins :
- 532
- Datasheets
- TMS32C6415DGLZ6E3

DSP Texas Instruments TMS32C6415DGLZ6E3 Overview
The DSP Texas Instruments TMS32C6415DGLZ6E3 is a high-performance, fixed-point digital signal processor designed to meet the demanding requirements of multimedia and telecommunications applications. As an integral component from Texas Instruments, this IC excels in environments where efficient and rapid processing of digital signals is critical. The TMS32C6415DGLZ6E3 leverages advanced semiconductor technology, offering robust processing capabilities in a compact 532-ball BGA package. This product is tailored for developers looking for scalable solutions that ensure minimal power consumption and maximum reliability.
TMS32C6415DGLZ6E3 Features
This IC incorporates a range of features designed to optimize performance and facilitate system integration. Key attributes include high-speed data processing capabilities, enhanced memory architecture, and support for multiple interfaces. The TMS32C6415DGLZ6E3 offers an extensive set of peripherals, making it highly adaptable to new and evolving technological demands.
TMS32C6415DGLZ6E3 Applications
- Telecommunications: Used in equipment for data transmission and signal processing, enhancing both speed and reliability.
- Audio Processing: Integral in devices requiring high-quality sound processing, including synthesizers and audio mixing boards.
- Video Processing: Ideal for high-definition video streaming and editing platforms, where speed and clarity are paramount.
- Medical Imaging: Critical for the rapid and accurate processing required in modern medical imaging equipment, such as MRI and ultrasound machines.
- Industrial Automation: Employs advanced control systems to improve the efficiency and precision of automated manufacturing processes.
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