TMS32C6414EGLZA6E3

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Mfr.Part #
TMS32C6414EGLZA6E3
Manufacturer
Texas Instruments
Package / Case
532-BFBGA, FCBGA
Datasheet
Download
Description
IC FIXED POINT DSP 532-FCBGA
Stock
20,395
In Stock :
20,395

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Mount :
Surface Mount
Memory Size :
128kB
Mounting Type :
Surface Mount
Data Bus Width :
32b
Barrel Shifter :
No
Voltage - I/O :
3.30V
Lead Free :
Contains Lead
Terminal Form :
Ball
Operating Supply Voltage :
1.4V
JESD-609 Code :
e0
Number of External Interrupts :
4
Bit Size :
32
Non-Volatile Memory :
External
Base Part Number :
32C6414
Max Supply Voltage :
3.46V
Width :
23mm
Min Supply Voltage :
1.36V
Voltage - Core :
1.40V
Lifecycle Status :
ACTIVE (Last Updated: 3 days ago)
Factory Lead Time :
6 Weeks
Number of I/O :
16
Weight :
3.131403g
Number of Terminations :
532
Number of Pins :
532
On Chip Data RAM :
1.03MB
Length :
23mm
Power Supplies :
1.43.3V
Frequency :
600MHz
Operating Temperature :
-40°C~105°C TC
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Internal Bus Architecture :
Multiple
Peak Reflow Temperature (Cel) :
220
Integrated Cache :
yes
Packaging :
Tray
Type :
FIXED POINT
Terminal Pitch :
0.8mm
Supply Voltage :
1.4V
Interface :
Host Interface, McBSP
Number of DMA Channels :
64
Series :
TMS320C6414/15/16
Radiation Hardening :
No
Package / Case :
532-BFBGA, FCBGA
Supply Current-Max :
125mA
Height :
3.25mm
Terminal Finish :
Tin/Lead (Sn/Pb)
Terminal Position :
BOTTOM
Number of Timers :
3
ECCN Code :
3A991.A.2
Low Power Mode :
yes
Memory Type :
SDRAM, SRAM
Thickness :
2.61mm
Boundary Scan :
yes
Additional Feature :
ALSO REQUIRES 3.3VI/O SUPPLY
Pin Count :
532
RoHS Status :
Non-RoHS Compliant
HTS Code :
8542.31.00.01
Introducing DSP (Digital Signal Processors) Texas Instruments TMS32C6414EGLZA6E3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:32C6414, Number of Terminations:532, Number of Pins:532, Operating Temperature:-40°C~105°C TC, Type:FIXED POINT, Package / Case:532-BFBGA, FCBGA, TMS32C6414EGLZA6E3 pinout, TMS32C6414EGLZA6E3 datasheet PDF, TMS32C6414EGLZA6E3 amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMS32C6414EGLZA6E3 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMS32C6414EGLZA6E3


DSP Texas Instruments TMS32C6414EGLZA6E3 Overview

The DSP Texas Instruments TMS32C6414EGLZA6E3 is a high-performance fixed-point digital signal processor designed to meet the intensive processing demands of modern embedded applications. Engineered by Texas Instruments, a leader in semiconductor design and manufacturing, this DSP integrates advanced features into a compact 532-ball FCBGA (Fine-Pitch Ball Grid Array) package. This processor is particularly suited for applications requiring high-speed numerical processing, such as audio and video processing, telecommunications, and digital signal modulation. The DSP Texas Instruments TMS32C6414EGLZA6E3 provides a robust platform for developing sophisticated signal processing systems that require high reliability and precision.

TMS32C6414EGLZA6E3 Features

The TMS32C6414EGLZA6E3 boasts a range of features that make it an optimal choice for demanding signal processing tasks. These include a high clock rate, large internal memory, and extensive interfacing capabilities. Additionally, its ability to execute multiple instructions per cycle enhances its efficiency, making it ideal for high-throughput applications. The incorporation of a sophisticated cache architecture and the support for external memory interfaces further extend its functionality, allowing for versatile system designs.

TMS32C6414EGLZA6E3 Applications

  • Audio Processing Systems: Utilizes its high-speed processing capabilities to handle complex audio synthesis, effects processing, and audio signal compression.
  • Video Processing Equipment: Supports high-definition video processing tasks, including video compression, image stabilization, and streaming applications.
  • Telecommunications Infrastructure: Employs in telecommunications systems for tasks such as signal modulation and demodulation, encoding, and real-time data transmission.
  • Industrial Control Systems: Ideal for control applications in automated manufacturing, where precise and rapid processing of digital signals is crucial.
  • Medical Imaging Devices: Applied in medical imaging technologies such as MRI and ultrasound for real-time image processing and complex calculations.
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