TMS320VC5510GGW2
- Mfr.Part #
- TMS320VC5510GGW2
- Manufacturer
- Texas Instruments
- Package / Case
- 240-LFBGA
- Datasheet
- Download
- Description
- IC DSP FIXED PT 400MIPS 240-BGA
- Stock
- 6,682
- In Stock :
- 6,682
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Qualification Status :
- Not Qualified
- Terminal Finish :
- TIN LEAD
- Pin Count :
- 240
- Number of Pins :
- 240
- Voltage - Core :
- 1.60V
- Internal Bus Architecture :
- Multiple
- Max Supply Voltage :
- 3.6V
- ECCN Code :
- 3A001.A.3
- HTS Code :
- 8542.31.00.01
- Height Seated (Max) :
- 1.4mm
- Mounting Type :
- Surface Mount
- Length :
- 15mm
- Terminal Form :
- Ball
- RoHS Status :
- Non-RoHS Compliant
- Series :
- TMS320C55x
- Bit Size :
- 16
- Terminal Pitch :
- 0.8mm
- RAM Size :
- 320kB
- Supply Voltage :
- 1.6V
- Width :
- 15mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 240-LFBGA
- Voltage - I/O :
- 3.30V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Non-Volatile Memory :
- ROM (32kB)
- Mount :
- Surface Mount
- Base Part Number :
- 320VC5510
- Frequency :
- 200MHz
- Operating Temperature :
- 0°C~85°C TC
- Packaging :
- Tray
- RAM (words) :
- 32768
- Type :
- FIXED POINT
- JESD-609 Code :
- e0
- Power Supplies :
- 1.63.3V
- Lead Free :
- Contains Lead
- Terminal Position :
- BOTTOM
- Number of Terminations :
- 240
- Peak Reflow Temperature (Cel) :
- 220
- Barrel Shifter :
- No
- Min Supply Voltage :
- 1.55V
- On Chip Data RAM :
- 344kB
- Boundary Scan :
- yes
- Low Power Mode :
- yes
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Interface :
- Host Interface, McBSP
- Address Bus Width :
- 22
- External Data Bus Width :
- 32
- Memory Size :
- 32kB
- Datasheets
- TMS320VC5510GGW2

DSP Texas Instruments TMS320VC5510GGW2 Overview
The DSP Texas Instruments TMS320VC5510GGW2 is a high-performance fixed-point digital signal processor designed to meet the rigorous demands of signal processing applications requiring intense mathematical operations. Offering a robust 400 MIPS (Million Instructions Per Second), this processor is encapsulated in a compact 240-BGA (Ball Grid Array) package, ensuring efficient spatial integration in embedded systems. Its high throughput and processing capabilities make it ideal for a range of industrial and consumer electronics applications where precision and speed are paramount. This product is particularly tailored for developers looking to integrate reliable DSP functionality into their designs, providing a versatile platform for innovation and advanced signal manipulation.
TMS320VC5510GGW2 Features
The TMS320VC5510GGW2 from Texas Instruments is equipped with multiple features that enhance its functionality in complex signal processing tasks. These include advanced power management controls that cater to low-power consumption requirements, dual high-performance multipliers and ALUs (Arithmetic Logic Units) that accelerate data throughput, and a rich set of peripherals for enhanced I/O capabilities. Additionally, its support for a wide range of audio and speech signal processing tasks makes it a flexible choice for multimedia applications.
TMS320VC5510GGW2 Applications
- Audio Processing: Utilized in audio equipment for effects processing, audio mixing, and sound enhancement, optimizing clarity and sound quality.
- Speech Recognition: Serves as the processing core in devices requiring voice command features, such as smart speakers and interactive voice response systems.
- Medical Imaging: Applied in medical diagnostic equipment such as ultrasound and MRI machines, enhancing image processing speeds and accuracy.
- Telecommunications: Employs its robust processing power in telecommunications infrastructure to manage signal integrity and improve data transmission efficiency.
- Industrial Control: Integral to control systems in manufacturing and automation, improving real-time processing of sensor data and system management.
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