TMS320C6203BGNY17C
- Mfr.Part #
- TMS320C6203BGNY17C
- Manufacturer
- Texas Instruments
- Package / Case
- 384-FBGA, FCCSPBGA
- Datasheet
- Download
- Description
- IC FIXED-POINT DSP 384-BGA
- Stock
- 3,931
- In Stock :
- 3,931
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Number of Pins :
- 384
- Series :
- TMS320C62x
- Boundary Scan :
- yes
- Interface :
- McBSP
- Base Part Number :
- 320C6203
- Lead Free :
- Contains Lead
- Mount :
- Surface Mount
- Bit Size :
- 32
- Voltage - Core :
- 1.50V
- Packaging :
- Tray
- Pin Count :
- 384
- Low Power Mode :
- yes
- Type :
- FIXED POINT
- Operating Temperature :
- 0°C~90°C TC
- Frequency :
- 173MHz
- Terminal Pitch :
- 0.8mm
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RAM (words) :
- 524288
- Min Supply Voltage :
- 1.65V
- Package / Case :
- 384-FBGA, FCCSPBGA
- Voltage - I/O :
- 3.30V
- Supply Voltage :
- 1.7V
- HTS Code :
- 8542.31.00.01
- Data Bus Width :
- 16b
- Number of Terminations :
- 384
- Terminal Position :
- BOTTOM
- Height Seated (Max) :
- 2.35mm
- Max Supply Voltage :
- 3.46V
- Mounting Type :
- Surface Mount
- Weight :
- 1.433494g
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pbfree Code :
- No
- Internal Bus Architecture :
- Multiple
- Address Bus Width :
- 22
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 220
- RAM Size :
- 896kB
- Non-Volatile Memory :
- External
- Operating Supply Voltage :
- 3.3V
- Length :
- 18mm
- Reach Compliance Code :
- not_compliant
- ECCN Code :
- 3A001.A.3
- Terminal Form :
- Ball
- Barrel Shifter :
- No
- Datasheets
- TMS320C6203BGNY17C

DSP Texas Instruments TMS320C6203BGNY17C Overview
The DSP Texas Instruments TMS320C6203BGNY17C is a highly efficient fixed-point digital signal processor designed to meet the demanding requirements of high-performance, real-time signal processing applications. This IC, encapsulated in a 384-ball BGA package, is renowned for its robust processing capabilities and low power consumption, making it an ideal choice for developers looking to integrate advanced DSP technology into their systems. The TMS320C6203BGNY17C is engineered to deliver superior performance in terms of speed and accuracy, enhancing the functionality and reliability of a wide array of electronic products.
TMS320C6203BGNY17C Features
This DSP unit offers a multitude of features that are beneficial for a variety of processing needs. Key features include a high-performance, fixed-point architecture that is capable of executing up to billions of operations per second, and a large 384 BGA package that ensures a compact yet robust design. Additionally, the TMS320C6203BGNY17C supports a wide range of peripherals and interfaces, enhancing its adaptability in complex digital signal processing systems.
TMS320C6203BGNY17C Applications
- Telecommunications: Utilized in systems for signal modulation and demodulation, error detection and correction, and network protocol management, ensuring high-speed data transmission and reliability.
- Audio Processing: Enhances audio devices with capabilities such as sound effect generation, audio synthesis, and advanced audio signal filtering, providing high-fidelity sound quality.
- Medical Imaging: Critical in medical diagnostic equipment, such as ultrasound and MRI machines, where it processes complex imaging algorithms to deliver clear and accurate diagnostic images.
- Industrial Control: Deployed in automated manufacturing systems, where it performs real-time control and processing tasks to optimize production efficiency and safety.
- Automotive Systems: Used in vehicle safety and entertainment systems, improving functionalities like collision avoidance systems and multimedia processing.
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